HIGH EFFICIENCY RECTIFIER
1G1 THRU 1G7
FEATURES
R-1
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·
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Glass passivated chip junction
Low forward voltage drop
Low reverse leakage
High forward surge current capability
High temperature soldering guaranteed:
.025(0.6)
.021(0.5)
.787
(20.0)
MIN.
260℃/10 secods,0.375”(9.5mm)lead length at 5 lbs(2.3kg) tension
.138(3.5)
.114(2.9)
.102(2.6)
.087(2.2)
DIA.
DIA.
MECHANICAL DATA
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Case: Transfer molded plastic
.787
(20.0)
MIN.
Epoxy: UL94V-0 rate flame retardant
Polarity: Color band denotes cathode end
Lead: Plated axial lead, solderable per MIL-STD-202E method 208C
Mounting position: Any
.025(0.6)
.021(0.5)
Weight: 0.007ounce, 0.20 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
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Ratings at 25OC ambient temperature unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load
For capacitive load derate current by 20%
SYMBOLS
UNIT
1G1
1G2
1G3
1G4
1G5
1G6
1G7
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
VRRM
VRMS
VDC
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
Volts
Volts
Volts
Maximum DC Blocking Voltage
100
1000
Maximum Average Forward Rectified Current
0.375”(9.5mm) lead length at TA= 25℃
I(AV)
1.0
Amp
Peak Forward Surge Current
8.3mS single half sine wave superimposed on
rated load (JEDEC method)
IFSM
VF
IR
25
Amps
Volts
µA
Maximum Instantaneous Forward Voltage @ 1.0A
1.1
5.0
50
TA = 25℃
TA = 125℃
Maximum DC Reverse Current at Rated
DC Blocking Voltage
Maximum DC Reverse Current, full cycle
IR(AV)
30
µA
Average 0.375(9.5mm) lead length at TL=75℃
Typical Junction Capacitance (NOTE 1)
Typical Thermal Resistance (NOTE 2)
Operating Temperature Range
CJ
RθJA
TJ
15
50
pF
℃/W
(-55 to +150)
(-55 to +150)
℃
Storage Temperature Range
TSTG
Notes:
1.Measured at 1.0MHz and a]pplied Reverse voltage of 4.0Volits.
2. Thermal Resistance from Junction to Ambient at. 375”(9.5mm)lead length, P.C. board mounted.
Web Site:
WWW.PS-PFS.COM