LM2736
SNVS316F –SEPTEMBER 2004–REVISED APRIL 2013
www.ti.com
Connection Diagram
1
2
3
BOOST
1
2
3
6
5
4
SW
6
5
4
GND
FB
V
IN
EN
Figure 1. 6-Lead SOT
Figure 2. Pin 1 Indentification
See Package Number DDC (R-PDSO-G6)
PIN DESCRIPTIONS
Pin
Name
Function
1
BOOST Boost voltage that drives the internal NMOS control switch. A bootstrap capacitor is connected between the
BOOST and SW pins.
2
GND
Signal and Power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin
for accurate regulation.
3
4
5
6
FB
EN
VIN
SW
Feedback pin. Connect FB to the external resistor divider to set output voltage.
Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3V.
Input supply voltage. Connect a bypass capacitor to this pin.
Output switch. Connects to the inductor, catch diode, and bootstrap capacitor.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
VIN
-0.5V to 22V
-0.5V to 22V
-0.5V to 28V
-0.5V to 6.0V
-0.5V to 3.0V
-0.5V to (VIN + 0.3V)
150°C
SW Voltage
Boost Voltage
Boost to SW Voltage
FB Voltage
EN Voltage
Junction Temperature
ESD Susceptibility(2)
Storage Temp. Range
2kV
-65°C to 150°C
220°C
Infrared/Convection Reflow (15sec)
Wave Soldering Lead Temp. (10sec)
Soldering Information
260°C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Human body model, 1.5kΩ in series with 100pF.
2
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM2736