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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 1963841-3 | TE |
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THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1963841-5 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1963842-1 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1963842-3 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1963842-5 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1963845 | PHOENIX |
获取价格 |
Strip Terminal Block, 4A, 1 Row(s), 1 Deck(s), ROHS COMPLIANT |
|
| 1963858 | PHOENIX |
获取价格 |
Strip Terminal Block, 4A, 1 Row(s), 1 Deck(s), ROHS COMPLIANT |
|
| 1-963860-1 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1-963860-2 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
| 1-963860-3 | TE |
获取价格 |
THIS DRAWING IS A CONTROLLED DOCUMENT. |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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