Pluggable Input / Output Solutions
XFP Products
Product Facts
I 10 Gb/s serial link
I EMI containment features
I
I
Module to XFP Cage
XFP Cage to Chassis
I Uses 30 pin surface mount
connector
I Patented riding heat sink for
thermal management
I Press fit cage termination
I Designed to support
belly-to-belly applications
I UL/CSA Report
File E28476
R
R
XFP was developed to pro-
ment, and was the first
available in three heights,
and custom heat sinks are
possible. This heat sink
technology has extended to
SFP and QSFP applications.
The XFP connector is a 30
position PT connector, using
the same design as used
in SFP for established
vide 10Gb/s serial links for a pluggable interface to
wide range of applications
including standards such as heat sink technology for
OC192/STM-64, G.709, and
10 Gigabit Ethernet.
incorporate patented riding
thermal dissipation. The
heat sink is mounted to the
cage using a clip, which
provides a load to maintain
contact between heat sink
The cage /plug interface
features an intuitive latch
system, gasketing features
for excellent EMI contain-
and module. Heat sinks are performance and reliability.
Cages
Technical Documents
PCB
Instruction Sheet
Part Number
Description
Attachment
408-8723
1489951-1
1658871-1
1888101-1
1658945-1
1888116-1
1888116-2
1888065-1
1888481-1
1888481-2
1888481-3
XFP Cage
Press Fit
Application Specification
114-13096
XFP Cage w/Insulating Tape
Press Fit
Press Fit
Press Fit
Press Fit
Press Fit
Press Fit
Press Fit
Press Fit
Press Fit
XFP Cage without Rear Gasket
XFP Cage w/Insulating Tape & without Rear Gasket
XFP Kit: XFP Cage with SAN Heat Sink (6.5mm)
XFP Kit: XFP Cage with PCI Heat Sink (4.2mm)
XFP Kit: XFP Cage with Networking Heat Sink (13.5mm)
XFP Kit: XFP Cage w/insulating tape and SAN Heat Sink (6.5mm)
XFP Kit: XFP Cage w/insulating tape and PCI Heat Sink (4.2mm)
XFP Kit: XFP Cage w/insulating tape w/Networking Heat Sink (13.5mm)
Product Specifications
108-2127
XFP Standard
SFF Document INF-8077
Connectors, Heatsinks, and Accessories
Part Number
788862-1
Description
30 Pos SMT XFP Conn. 0.38 µm (15 µin) gold plating
30 Pos SMT XFP Conn, 0.76 µm (30 µin) gold plating
788862-2
30 Pos SMT XFP Conn, 0.76 µm (30 µin) gold plating
with contact treatment, and enhanced contact for
high speed signals
1367500-1
1489948-2
1888810-2
1542656-2
1542618-2
1542706-2
XFP Heat Sink Clip
XFP EMI/Dust Plug
SAN Heat Sink (6.5mm)
PCI Heat Sink (4.2mm)
Networking Heat Sink (13.5mm)
PCI is a trademark of PCI-SIG.
Note: All part numbers are RoHS compliant.
25
Catalog 1773408-1
Revised 2-09
Dimensions are in millimeters
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
and inches unless otherwise
reference purposes only.
Specifications subject
to change.
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
specified. Values in brackets
are metric equivalents.
www.tycoelectronics.com
UK: 44-8706-080-208
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