Datasheet > 175-6-240P

175-6-240P

更新时间： 2024-11-22 00:52:23

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THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

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175-6-240P 数据手册

WTS001_p50-68 6/14/07 10:46 AM Page 64

Accessory

Products

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with

120 SERIES

a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem-

perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal

Resistivity graph below).

TYPICAL VALUES FOR THERMAL RESISTANCE,

120 SERIES - THERMAL JOINT COMPOUND

CASE TO SINK (Ø ) WHEN THERMAL JOINT

Characteristic

Volume Resistivity

Description

5 X 10¹⁴ohm-cm

225 volts/mil

COMPOUNDS ARE USED

Typical

Mounting Torque Thermal

in inch • pounds Resistance

Dielectric Strength

Case Style Characteristics

T0-3

TO-66

(N•M)

8 (0.9)

9 (0.9)

(°C/W)

0.09

0.14

Specific Gravity

Thermal Conductivity @ 36°C

2.1 min.

0.735 W/(m)(K)

5.1(Btu) (in.)/(hr)(ft²)(°F)

TO-220

8 (0.9)

15 (1.7)

0.50

0.16

Thermal Resistivity (P)

Bleed, % after 24 hrs @ 200°C

Evaporation, % after 24 hrs @ 200°C

Color

56 (°C)(in.)/watt

0.5

0.19 (4.8) stud x 0.44 (11.2) hex

0.25 (6.4) stud x 0.69 (17.5) hex

0.38 (9.7) stud x 1.06 (26.9) hex

30 (3.39)

75 (8.47)

0.10

0.07

0.5

opaque white

5 years

0.50 (12.7) stud x 1.06 (26.9) hex

0.75 (19.1) stud x 1.25 (31.8) hex

125 (14.12)

600 (67.79)

0.07

0.052

Shelf life

Operating Temperature Range (°C)

-40/+200

120 SERIES - ORDER GUIDE

Series -

P/N

Container Size

120-SA

120-2

120-5

120-8

120-80

120-320

4 gram plastic pak

2 oz (0.06 kg) jar

5 oz (0.14 kg) tube

8 oz (0.23 kg) jar

5 lb (2.27 kg) can

20 lb (9.08 kg) can

HIGH PERFORMANCE THERMAL COMPOUND

122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to provide premium

performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where

power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors.

When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity

compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS

compliant.

122 SERIES

122 SERIES - ORDER GUIDE

122 SERIES THERMAL JOINT COMPOUND

Series -

Container Size

Typical Characteristics

Description

P/N

122-10CC

122-2

10cc syringe

2 oz (0.06 kg) jar

30cc syringe

Appearance

Smooth Gray paste

Thermal Conductivity

2.5 W / m °K,

17.3 (Btu) (in.)/(hr) (ft²) (⁰F)

122-30CC

Thermal Resistance

Bleed

0.02 °C in 2 / W

0.015 wt%, 24 hrs at 200°C

0.150 wt%, 24 hrs at 200°C

1.4 x 10¹⁰ohm-cm

225 volts/mil

Evaporation

Volume Resistivity

Dielectric Strength

Specific Gravity

Operating Range

Shelf Life

2.23 (gm/cc) at 25°C

-40°C to 205°C

5 years

12 3 4 5

中文翻译

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与175-6-240P相关器件

型号	品牌	获取价格	描述	数据表
1756249	PHOENIX	获取价格	Barrier Strip Terminal Block,
175-6-250P	ETC	获取价格	THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
1756252	PHOENIX	获取价格	Barrier Strip Terminal Block,
1756256	PHOENIX	获取价格	Barrier Strip Terminal Block
1756265	PHOENIX	获取价格	TERM BLOCK PCB
1756269	PHOENIX	获取价格	MSTB 2,5/ 3-G BK
175628	MACOM	获取价格	This specification covers the requirements for product performance
175-6-280P	ETC	获取价格	THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
1756281	PHOENIX	获取价格	Barrier Strip Terminal Block,
1756285	PHOENIX	获取价格	Strip Terminal Block

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