Delivering the market’s cleanest signal integrity at 28+ Gbps, Molex’s modular
NeoScale™ Mezzanine System features a high-speed triad wafer design with
Solder-Charge Technology™ for customized PCB routing in high-density
system applications
NeoScale™ High-Speed
Mezzanine System
170807 Vertical Plug
Ideal for space-constrained designs with limited PCB real estate, the modular
NeoScale mezzanine system provides a durable and easily customizable design tool
for high-density system applications. Each NeoScale triad wafer is an independent
element in the housing and can be customized to a design layout.With four
triad wafer configurations, customers can mix and match components to build a
mezzanine solution to meet their requirements for signals supporting high-speed
differential pairs (85 and 100 ohm), high-speed single-ended transmissions, low-
speed single-ended signals and power contacts.
170814 Vertical Receptacle
For more information visit: www.molex.com/link/neoscale.html.
NeoScale™ High-Speed Mezzanine
System Left: Plug, Right: Receptacle
6-by-20 (120 triads)
FEATURES AND BENEFITS
• Patent-pending modular triad wafer
design with four triad configurations
and high-speed differential pairs (in
both 85 and 100 Ohm impedance),
high-speed single-ended traces, low-
speed single-ended lines and power
contacts provides a customized system
for design flexibility
• Connectors feature 246 circuits with
a density of 82 differential pairs per
square inch offers ultra-high-density
signal solution with optimal signal
integrity performance
• Innovative PCB connection using
patented Solder-Charge Technology™;
proven surface mount technology
(SMT) attach method for highly
reliable and robust solder joints
• Mirror-image triad layout enables the
PCB routing in one or two layers for
four- and six-row housings respectively
providing ease in PCB routing and
lowers overall system costs by
decreasing the number of PCB layers
required for signal routing
• Available in 12.00 to 42.00mm stack
heights, circuit sizes of 8 to 300 triad
wafers in 2-, 4-, 6-, 8- and 10-rows and
85 or 100 Ohm impedance provides
design flexibility to address engineering
constraints in system envelopes
• Housing design based on honeycomb
construction isolates each differential
pair for optimal performance and
customization
• Reliable mating interface with 2.00mm
wipe gives sufficient conductive wipe
for clean signal transmission and
enhanced performance
• High-speed triad wafers comprise
three pins per differential pair (two
signal pins and one shielded ground
pin) providing stand-alone 28+ Gbps
fully shielded differential pairs with
dedicated grounds
• Tombstone structures incorporated
within the receptacle housing prevents
terminal damage by protecting the
mating contact interface
• Durable housing material provides
a robust system with mechanical
stability
SPECIFICATIONS
Reference Information
Electrical
Physical
Packaging:Tray
Voltage (max.): 30V AC RMS max.
Current (max.): 1.0A
Housing: High-temperature LCP
Contact: Copper (Cu)
Mates With:
NeoScale Vertical Plug (Series
170807) mates with NeoScale
Vertical Receptacle (Series 170814)
Contact Resistance: 30 Milliohms max.
Plating:
Contact Area — 30µ" Gold (Au)
Solder Tail Area —15µ" Gold (Au)
Underplating — 45µ" Nickel (Ni)
Dielectric Withstanding Voltage:
200V AC RMS
Designed In: Millimeters
RoHS:Yes
Insulation Resistance:
1000 Megohms min.
Operating Temperature: -55 to +85°C
Halogen Free:Yes
Mechanical
Contact Retention to Housing: 1N
Mating Force: 0.75N max.
Unmating Force: 0.25N min.
Durability (min.): 100 cycles