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1708070015 PDF预览

1708070015

更新时间: 2024-11-21 20:55:31
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 1761K
描述
Board Connector, 48 Contact(s), 8 Row(s), Male, Straight, Solder Terminal, Plug, LOW HALOGEN, ROHS COMPLIANT

1708070015 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:LOW HALOGEN, ROHS COMPLIANT
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.40风险等级:5.77
其他特性:NEOSCALE, POLARIZED主体/外壳类型:PLUG
连接器类型:BOARD CONNECTOR联系完成配合:NOT SPECIFIED
触点性别:MALE触点材料:NOT SPECIFIED
DIN 符合性:NO滤波功能:NO
IEC 符合性:NOMIL 符合性:NO
插接信息:MULTIPLE MATING PARTS AVAILABLE混合触点:NO
安装方式:STRAIGHT安装类型:BOARD
装载的行数:8选件:GENERAL PURPOSE
端子节距:2.8 mm端接类型:SOLDER
触点总数:48UL 易燃性代码:94V-0
Base Number Matches:1

1708070015 数据手册

 浏览型号1708070015的Datasheet PDF文件第2页 
Delivering the market’s cleanest signal integrity at 28+ Gbps, Molex’s modular  
NeoScale™ Mezzanine System features a high-speed triad wafer design with  
Solder-Charge Technology™ for customized PCB routing in high-density  
system applications  
NeoScale™ High-Speed  
Mezzanine System  
170807 Vertical Plug  
Ideal for space-constrained designs with limited PCB real estate, the modular  
NeoScale mezzanine system provides a durable and easily customizable design tool  
for high-density system applications. Each NeoScale triad wafer is an independent  
element in the housing and can be customized to a design layout.With four  
triad wafer configurations, customers can mix and match components to build a  
mezzanine solution to meet their requirements for signals supporting high-speed  
differential pairs (85 and 100 ohm), high-speed single-ended transmissions, low-  
speed single-ended signals and power contacts.  
170814 Vertical Receptacle  
For more information visit: www.molex.com/link/neoscale.html.  
NeoScale™ High-Speed Mezzanine  
System Left: Plug, Right: Receptacle  
6-by-20 (120 triads)  
FEATURES AND BENEFITS  
• Patent-pending modular triad wafer  
design with four triad configurations  
and high-speed differential pairs (in  
both 85 and 100 Ohm impedance),  
high-speed single-ended traces, low-  
speed single-ended lines and power  
contacts provides a customized system  
for design flexibility  
• Connectors feature 246 circuits with  
a density of 82 differential pairs per  
square inch offers ultra-high-density  
signal solution with optimal signal  
integrity performance  
• Innovative PCB connection using  
patented Solder-Charge Technology™;  
proven surface mount technology  
(SMT) attach method for highly  
reliable and robust solder joints  
• Mirror-image triad layout enables the  
PCB routing in one or two layers for  
four- and six-row housings respectively  
providing ease in PCB routing and  
lowers overall system costs by  
decreasing the number of PCB layers  
required for signal routing  
• Available in 12.00 to 42.00mm stack  
heights, circuit sizes of 8 to 300 triad  
wafers in 2-, 4-, 6-, 8- and 10-rows and  
85 or 100 Ohm impedance provides  
design flexibility to address engineering  
constraints in system envelopes  
• Housing design based on honeycomb  
construction isolates each differential  
pair for optimal performance and  
customization  
• Reliable mating interface with 2.00mm  
wipe gives sufficient conductive wipe  
for clean signal transmission and  
enhanced performance  
• High-speed triad wafers comprise  
three pins per differential pair (two  
signal pins and one shielded ground  
pin) providing stand-alone 28+ Gbps  
fully shielded differential pairs with  
dedicated grounds  
Tombstone structures incorporated  
within the receptacle housing prevents  
terminal damage by protecting the  
mating contact interface  
• Durable housing material provides  
a robust system with mechanical  
stability  
SPECIFICATIONS  
Reference Information  
Electrical  
Physical  
Packaging:Tray  
Voltage (max.): 30V AC RMS max.  
Current (max.): 1.0A  
Housing: High-temperature LCP  
Contact: Copper (Cu)  
Mates With:  
NeoScale Vertical Plug (Series  
170807) mates with NeoScale  
Vertical Receptacle (Series 170814)  
Contact Resistance: 30 Milliohms max.  
Plating:  
Contact Area — 30µ" Gold (Au)  
Solder Tail Area —15µ" Gold (Au)  
Underplating — 45µ" Nickel (Ni)  
Dielectric Withstanding Voltage:  
200V AC RMS  
Designed In: Millimeters  
RoHS:Yes  
Insulation Resistance:  
1000 Megohms min.  
Operating Temperature: -55 to +85°C  
Halogen Free:Yes  
Mechanical  
Contact Retention to Housing: 1N  
Mating Force: 0.75N max.  
Unmating Force: 0.25N min.  
Durability (min.): 100 cycles  

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