Datasheet > 156B1

156B1

更新时间： 2024-02-13 14:54:43

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描述
Surface Mount Chip LEDs

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156B1 数据手册

Surface Mount Bi-Color Chip LEDs

MSL-156X SERIES

Description

Package Dimensions

The MSL-156xx , a series of bi-color Chip LED device ,

is designed in an industry standard package suitable for

SMT assembly method . This series contain different

combinations of Red & Green chips to provide broad

range choices in wavelength and intensity . They are

LED die

A (Short wavelength)

LED die

B (Long wavelength)

0.50

(.020)

2.7

(.106)

Cathode mark

all molded in white diffused epoxy package.

PCB

1.4

Features

(0.055)

0.60

(.024)

l Small Size

0.90

(0.036)

l Industry Standard Footprint

l Compatible with IR Solder process

l Availalble in 8 mm Tape on 7"(178mm)

Diameter Reels

0.9

Polarity

l Dual color

(0.035)

Soldering Terminal

Applications

l Push-button backlighting

l LCD backlighting

l Symbol backlighting

l Front panel indicator

NOTE:

1. All dimensions are in millimeter (inches)

2. Tolerance is ± 0.1mm (.004") unless otherwise specified.

Absolute Maximum Ratings

Parameter

@ T_A=25^oC

Maximum Rating

Symbol

Units

Peak Forward Current

DC Forward Current⁽¹⁾

I_FP

I_F

Power Dissipation

P_D

Reverse Voltage ( I_R= 100 mA )

Operating Temperature Range

Storage Temperature Range

V_R

^oC

-20 to + 80

-30 to + 100

T_OPR

T_STG

^oC

Notes:

1. Derate linearly as shown in figure 4 for temperatures above 25^oC

Unity Opto Technology Co., Ltd.

12/11/2000

12 3

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