Datasheet > 132-PGM13072-30

132-PGM13072-30

更新时间： 2024-09-27 06:26:03

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描述
QFP-to-PGA Adapter 0.025 [0.64] Pitch

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132-PGM13072-30 数据手册

P/N 95-132I25 JEDEC 132-Position

QFP-to-PGA Adapter 0.025 [0.64] Pitch

FEATURES

• Convert surface-mount QFP packages to a 13x13 PGA footprint.

• Reduce costs by using less-expensive QFP packages to replace PGA footprints in

existing designs.

• Pins are mechanically fastened and soldered to board using Aries patented process,

creating a reliable electrical connection and rugged contact.

• Consult factory for Panelized Form or for mounting of consigned chips.

GENERAL SPECIFICATIONS

• ADAPTOR BODY: FR-4 with 1-oz. Cu traces

• PADS: Bare Cu protected with Entek^®by Enthone or immersion white Sn to

eliminate coplanarity concerns and solder bridges associated with hot air solder

leveling

CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity. NOTE: Aries reserves the

right to change product general specifications without notice.

• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]

Ni per SAE AMS-QQ-N-290

• OPERATING TEMPERATURE: 221°F [105°C]

ORDERING INFORMATION

P/N 95132125 QFP-to-PGA 13x13 Adapter

P/N 995132125-P QFP-to-PGA 13x13

Panilized Form

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia.

• Will plug into standard PGA socket

P/N 132PGM13072-30 QFP-to-PGA 13x13

Wire Wrap

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ROW-TO-ROW AND PIN-TO-PIN 0.003 [ 0.08]

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

Bristol, PA 19007-6810 USA

TEL (215) 781-9956 • FAX (215) 781-9845

WWW.ARIESELEC.COM• INFO@ARIESELEC.COM

18017

Rev. AA

PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

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