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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 10-503140-032 | AMPHENOL |
获取价格 |
The Interconnection Leader |
|
| 10-503220-073 | AMPHENOL |
获取价格 |
Rack and Panel Connector, 128 Contact(s) |
|
| 1050340001 | MOLEX |
获取价格 |
2.54mm (.100") Pitch SIM Card Connector, Push-Push Type, 6 Circuits, SMT, with Solder Tabs |
|
| 1050341001 | MOLEX |
获取价格 |
2.54mm (.100") Pitch SIM Card Connector, Push-Push Type, 6 Circuits, SMT, with Solder Tab, |
|
| 1050350001 | MOLEX |
获取价格 |
0.80mm (.031") Pitch, USB On-The-Go (OTG) Mini-B Receptacle, Mid-Mount, SMT, with Through |
|
| 105035-0001 | MOLEX |
获取价格 |
0.80mm (.031") Pitch, USB On-The-Go (OTG) Mini-B Receptacle, Mid-Mount, SMT, with Through |
|
| 1050380001 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Battery Connector, SMT, Contact Width 7.00mm (.276"), Working Height |
|
| 1050390001 | MOLEX |
获取价格 |
2.54mm (.100") Pitch Hinged SIM Card Connector, Shielded, 0.30u (12u) Gold (Au) Plating ov |
|
| 1050400001 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Battery Connector, 3 Circuits, Surface Mount, Contact Width 0.70mm (. |
|
| 1050480000 | WEIDMULLER |
获取价格 |
Screw Clamp 35 mm DIN-Rail Terminals |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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