100371F

更新时间： 2024-02-06 20:29:10

品牌	Logo	应用领域
美国国家半导体 - NSC		复用器
页数	文件大小	规格书
8页	126K
描述
Low Power Triple 4-Input Multiplexer with Enable

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技术参数
数据手册

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100371F 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	SOIC	包装说明：	SOP, SOP24,.4
针数：	24	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.71
Is Samacsys：	N	系列：	100K
JESD-30 代码：	R-PDSO-G24	JESD-609代码：	e0
长度：	15.4 mm	逻辑集成电路类型：	MULTIPLEXER
功能数量：	3	输入次数：	4
输出次数：	1	端子数量：	24
最高工作温度：	85 °C	最低工作温度：
输出特性：	OPEN-EMITTER	输出极性：	COMPLEMENTARY
封装主体材料：	PLASTIC/EPOXY	封装代码：	SOP
封装等效代码：	SOP24,.4	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	包装方法：	TAPE AND REEL
峰值回流温度（摄氏度）：	NOT SPECIFIED	电源：	-4.5 V
最大电源电流（ICC）：	75 mA	Prop。Delay @ Nom-Sup：	1.4 ns
传播延迟（tpd）：	1.5 ns	认证状态：	Not Qualified
座面最大高度：	2.65 mm	子类别：	Multiplexer/Demultiplexers
表面贴装：	YES	技术：	ECL
温度等级：	OTHER	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.5 mm	Base Number Matches：	1

100371F 数据手册

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Recommended Operating

Conditions

Case Temperature (T_C)

Military

−55˚C to +125˚C

−5.7V to −4.2V

Note 1: Absolute maximum ratings are those values beyond which the de-

vice may be damaged or have its useful life impaired. Functional operation

under these conditions is not implied.

Storage Temperature (T_STG

)

−65˚C to +150˚C

Supply Voltage (V_EE

)

Maximum Junction Temperature (T_J)

Ceramic

+175˚C

−7.0V to +0.5V

V_EEto +0.5V

−50 mA

V_EEPin Potential to Ground Pin

Input Voltage (DC)

Note 2: ESD testing conforms to MIL-STD-883, Method 3015.

Output current (DC Output HIGH)

ESD (Note 2)

≥2000V

Military Version

DC Electrical Characteristics

V_EE−4.2V to −5.7V, V_CCV_CCAGND, T_C−55˚C to +125˚C

Symbol

Parameter

Min

Max

Units

T_C

Conditions

Notes

V_OH

Output HIGH Voltage

−1025

−870

0˚C to

+125˚C

−55˚C

−1085

−870

V_INV (Max)

Loading with

(Notes 3, 4,

V_OL

Output LOW Voltage

Output HIGH Voltage

Output LOW Voltage

−1830 −1620

0˚C to

or V_{IL (Min)}

50Ω to −2.0V

+125˚C

−55˚C

−1830 −1555

−1035

V_OHC

0˚C to

+125˚C

−55˚C

−1085

−1610

V_INV_IH(Min)

Loading with

(Notes 3, 4,

V_OLC

0˚C to

or V_IL(Max)

50Ω to −2.0V

+125˚C

−55˚C

−1555

V_IH

V_IL

I_IL

Input HIGH Voltage

Input LOW Voltage

Input LOW Current

Input HIGH Current

−1165

−870

−55˚C to

+125˚C

−55˚C to

+125˚C

−55˚C to

+125˚C

Guaranteed HIGH Signal

for All Inputs

(Notes 3, 4,

5, 6)

−1830 −1475

0.50

µA

Guaranteed LOW Signal

for All Inputs

(Notes 3, 4,

5, 6)

V_EE−4.2V

(Notes 3, 4,

V_INV_IL(Min)

I_IH

_0X–I_3X

340

300

490

450

µA

0˚C to

+125˚C

−55˚C

(Notes 3, 4,

V_EE−5.7V

S₀, S₁, E

_0X–I_3X

V_INV_IH(Max)

S₀, S₁, E

I_EE

Power Supply Current

−80

−30

−55˚C to

+125˚C

Inputs Open

(Notes 3, 4,

Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately

without allowing for the junction temperature to stabilize due to heat dissapation after power-up. This provides “cold start” specs which can be considered a worst case

condition at cold temperatures.

Note 4: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.

Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.

Note 6: Guaranteed by applying specified input condition and testing V /V

OH OL

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