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0876550007

更新时间： 2024-11-25 06:20:19
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器双倍数据速率
页数 文件大小 规格书
5页 220K
描述
1.27mm (.050) Pitch DDR DIMM Socket, Right Angle, Single Key, with Beveled Metal Pin and Plastic Pegs, 184 Circuits, 0.76μm (30μ) Gold (Au) Plating

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0876550007 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete包装说明：ROHS COMPLIANT
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.77
Is Samacsys：N其他特性：POLARIZED
主体/外壳类型：SOCKET连接器类型：CARD EDGE CONNECTOR
联系完成配合：GOLD (30)联系完成终止：TIN (100)
触点性别：FEMALE触点材料：NOT SPECIFIED
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOJESD-609代码：e3
MIL 符合性：NO混合触点：NO
安装方式：RIGHT ANGLE安装类型：BOARD
装载的行数：2选件：GENERAL PURPOSE
端子节距：1.27 mm端接类型：SOLDER
触点总数：184Base Number Matches：1

0876550007 数据手册

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This document was generated on 04/09/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0876550007  
Active  
Description:  
1.27mm (.050") Pitch DDR DIMM Socket, Right Angle, Single Key, with Beveled Metal  
Pin and Plastic Pegs, 184 Circuits, 0.76µm (30µ") Gold (Au) Plating, 2.79mm (.110) Tail  
Length, Leadfree  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-87609-002 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
General  
Product Family  
Series  
Memory Module Sockets  
87655  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
Component Type  
JEDEC Outline  
Product Name  
Memory Module  
MO-206  
DDR DIMM  
Physical  
Circuits (Loaded)  
184  
Not Halogen-Free  
Color - Resin  
Black, Natural  
Durability (mating cycles max)  
Entry Angle  
25  
Need more information on product  
environmental compliance?  
90° Angle (Side Entry)  
Keying to Mating Part  
Material - Metal  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
Yes  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Brass, High Performance Alloy (HPA)  
Gold  
Tin  
High Temperature Thermoplastic  
Please visit the Contact Us section for any  
non-product compliance questions.  
0.110 In  
2.79 mm  
Yes  
PCB Retention  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.60 mm  
Tray  
Search Parts in this Series  
87655Series  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Temperature Range - Operating  
Termination Interface: Style  
0.050 In  
1.27 mm  
30.4  
0.76  
101.6  
2.54  
-10°C to +85°C  
Through Hole  
Mates With  
JEDEC standard 1.27mm modules  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
125V  
2.5V, Left  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
10  
SMC & Wave Capable (TH only)  
Max. Cycles at Max. Process Temperature  
Process Temperature max. C  
1
240  
Material Info  
Reference - Drawing Numbers  
12345

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