Datasheet > 0826B50-100J

0826B50-100J

更新时间： 2024-11-25 21:07:07

品牌	Logo	应用领域
安伦 - ANAREN		变压器
页数	文件大小	规格书
12页	725K
描述
RF Transformer, 800MHz Min, 2600MHz Max

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0826B50-100J 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
ECCN代码：	EAR99	风险等级：	5.66
最大截止频率：	2600 MHz	最小截止频率：	800 MHz
高度：	0.7 mm	插入损耗：	1.5 dB
长度：	2.03 mm	安装特点：	SURFACE MOUNT
最高工作温度：	85 °C	最低工作温度：	-55 °C
包装方法：	TAPE & REEL	物理尺寸：	2.03mm X 1.27mm X 0.7mm
表面贴装：	YES	变压器类型：	RF TRANSFORMER
宽度：	1.27 mm	Base Number Matches：	1

0826B50-100J 数据手册

Model 0826B50-100J

Rev A

Ultra Low Profile 0805 Balun

50Ω to 200Ω Balanced

Description

The 0826B50-100J is a low profile sub-miniature balanced to unbalanced

transformer designed for differential inputs and output locations on next generation

wireless chipsets in an easy to use surface mount package covering the GSM, DCS,

PCS, UMTS, CDMA and 802.11 b+g+n frequencies. The 0826B50-100J is ideal for

high volume manufacturing and is higher performance than traditional ceramic, and

lumped element baluns. The 0826B50-100J has an unbalanced port impedance of

50Ω and a 200Ω balanced port impedance**. This transformation enables single

ended signals to be applied to differential ports on modern integrated chipsets. The

output ports have equal amplitude (-3dB) with 180 degree phase differential. The

0826B50-100J is available on tape and reel for pick and place high volume

manufacturing.

Detailed Electrical Specifications*: Specifications subject to change without notice.

ROOM (25°C)

Features:

Parameter

Frequency

Min.

800

Typ.

Max

2600

Unit

MHz

Ω

• 800 – 2600 MHz

• 0.7mm Height Profile

• 50 Ohm to 2 x 100 Ohm

• GSM/DCS/PCS/UMTS/CDMA

• Low Insertion Loss

• Low Power

Unbalanced Port Impedance

Balanced Port Impedance**

Return Loss

Insertion Loss***

Amplitude Balance

Phase Balance

Power Handling

Thermal Resistance

Operating Temperature

100

1.1

±0.5

±4

Ω

1.3

±0.8

±8

0.5

TBD

+85

• Input to Output DC Isolation

• Surface Mountable

• Tape & Reel

Degrees

Watts

ºC / Watt

ºC

• Non-conductive Surface

-55

*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50 Ω nominal impedance.

P^**i⁵n^0ΩC^reo^fen^refⁿi^cg^eu^tor^ga^roti^uo^ndn^{. *** Insertion Loss stated at room temperature (1.5 dB Max at +85 ºC)}

The internal configuration of the ultra-low profile balun is diagramed to

the left; the unbalanced port is terminated in an open-circuit and the

two balanced ports are connected to ground. The ground connection

for the two balanced ports are connected together and brought out on

a common pin of the balun. This pin is labeled “DC/RF ground”. For

many chipset applications there is an opportunity to use this

configuration as a single bias point if applicable.

Balun Pin Configruation

λ 4

The use of differential circuits is increasing in highly integrated circuits,

because of its inherent noise immunity properties. Differential circuits

have superior performance when looking at properties like cross

coupling, immunity to external noise sources and power supply noise.

When designing power amplifiers differential circuits also help

minimize 2^ndand 3^rdorder intermodulation products.

λ 4

The construction of the ultra-low profile balun is bonded multi-layered

stripline made of low loss dielectric material with plated through vias

connecting the internal circuitry to the external printed circuit board,

similar to that of other Xinger hybrids and directional couplers.

USA/Canada:

Toll Free:

(315) 432-8909

(800) 411-6596

+44 2392-232392

Available on Tape

and Reel for Pick and

Place Manufacturing.

Europe:

12 3 4 5 6 7...12

中文翻译

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