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08051J0R9PBTTR PDF预览

08051J0R9PBTTR

更新时间： 2023-09-23 07:45:05
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX /
页数 文件大小 规格书
19页 217K
描述
Thin Film Capacitor

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中文翻译

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08051J0R9PBTTR 数据手册

 浏览型号08051J0R9PBTTR的Datasheet PDF文件第13页浏览型号08051J0R9PBTTR的Datasheet PDF文件第14页浏览型号08051J0R9PBTTR的Datasheet PDF文件第15页浏览型号08051J0R9PBTTR的Datasheet PDF文件第16页浏览型号08051J0R9PBTTR的Datasheet PDF文件第17页浏览型号08051J0R9PBTTR的Datasheet PDF文件第19页 
®
®
Accu-F / Accu-P  
Application Notes  
PREHEAT & SOLDERING  
CLEANING RECOMMENDATIONS  
The rate of preheat in production should not exceed 4ꢀC/  
second and a recommended maximum is about 2ꢀC/second.  
Temperature differential from preheat to soldering should not  
exceed 100ꢀC.  
For further specific application or process advice, please consult  
AVX.  
Care should be taken to ensure that the devices are  
thoroughly cleaned of flux residues, especially the space  
beneath the device. Such residues may otherwise become  
conductive and effectively offer a lossy bypass to the device.  
Various recommended cleaning conditions (which must be  
optimized for the flux system being used) are as follows:  
Cleaning liquids. . . . . . . i-propanol, ethanol, acetylacetone,  
water and other standard PCB  
1
COOLING  
cleaning liquids.  
After soldering, the assembly should preferably be allowed  
to cool naturally. In the event of assisted cooling, similar  
conditions to those recommended for preheating should be  
used.  
Ultrasonic conditions . . power-20w/liter max.  
frequency-20kHz to 45kHz.  
Temperature . . . . . . . . . 80ꢀC maximum (if not otherwise  
limited by chosen solvent system).  
Time . . . . . . . . . . . . . . . 5 minutes max.  
HAND SOLDERING & REWORK  
Hand soldering is permissible. Preheat of the PCB to 150ꢀC is  
required. The most preferable technique is to use hot air sol-  
dering tools. Where a soldering iron is used, a temperature  
controlled model not exceeding 30 watts should be used and  
set to not more than 260ꢀC.  
STORAGE CONDITIONS  
Recommended storage conditions for Accu-F® and  
Accu-P® prior to use are as follows:  
Temperature . . . . . . . . . . 15ꢀC to 35ꢀC  
Humidity . . . . . . . . . . . . . ≤65ꢁ  
Air Pressure . . . . . . . . . . 860mbar to 1060mbar  
RECOMMENDED SOLDERING  
PROFILE  
IR REFLOW  
WAVE SOLDERING  
3–5 seconds  
220  
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
60  
40  
Assembly exits heat–  
210  
200  
190  
180  
170  
160  
150  
140  
130  
120  
110  
100  
90  
no forced cooldown  
100°C  
Additional soak time  
to allow uniform  
heating of the  
substrate  
Natural  
Cooling  
186°C solder melting  
temperature  
Assembly enters the  
preheat zone  
45-60 sec.  
above solder  
melting point  
Enter Wave  
Time (seconds)  
Soak time  
20  
80  
1) Activates the flux  
2) Allows center of board  
temperatures to catch up with  
corners  
70  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120  
60  
50  
40  
30  
20  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
Time (mins)  
VAPOR PHASE  
Transfer from  
preheat with  
min. delay &  
temp. loss  
Preheat  
Reflow  
215°C  
215°C  
200  
180  
160  
140  
120  
100  
80  
200  
180  
160  
140  
120  
100  
80  
Duration varies  
Natural  
Cooling  
with thermal mass  
of assembly  
10–60 secs typical  
Enter  
Vapor  
60  
60  
40  
40  
20  
20  
0
0
10  
20  
30  
40  
50  
60  
70  
Time (minutes)  
Time (seconds)  
23  
1...1516171819

中文翻译

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