0603 size
Type C2Q
Surface Mount Very Fast-Acting Chip Fuse
C2QD0104
Typical
Cold
Resistance
(ohm)
Volt-drop
Melting I2T
Maximum
Power
Dissipation
(W)
Catalog
Number
Ampere
Rating
@100% In
@10 In
(Volt) max.
(A2 Sec)
C2Q 250
C2Q 300
C2Q 375
C2Q 500
C2Q 750
C2Q 1
250mA
300mA
375mA
500mA
750mA
1A
0.70
0.277
0.0002
0.08
0.10
0.11
0.13
0.18
0.22
0.27
0.31
0.39
0.48
0.58
0.67
0.76
0.98
0.52
0.259
0.246
0.227
0.203
0.189
0.180
0.175
0.166
0.162
0.161
0.160
0.160
0.160
0.0003
0.0004
0.0007
0.0018
0.003
0.005
0.008
0.014
0.024
0.036
0.050
0.065
0.107
0.41
Electrical Characteristics
(UL/CSA STD. 248-14)
0.29
Blow Time
0.17
Testing current
Minimum
4 hrs
Maximum
N/A
0.120
0.090
0.073
0.053
0.041
0.034
0.028
0.025
0.021
100%
200%
300%
C2Q 1.25
C2Q 1.5
C2Q 2
1.25A
1.5A
2A
N/A
5 sec
N/A
0.2 sec
C2Q 2.5
C2Q 3
2.5A
3A
rc
Approvals
C2Q 3.5
C2Q 4
3.5A
4A
Safety Agency Approvals
Amp range / Volt @ I.R. ability
C2Q 5
5A
250mA - 4A / 32V AC@ 35A
and 63V DC@ 50A
r
Recongnized File No. E20624
Consult manufacturer for other ratings
Physical Specification
Materials
Ceramic Substrate / Printed Element
Environmental Specification
SolderingTechniques & Compatibilty
Reflow: Industrial standard, 260°C peak
Wave Solder: 260°C, 10 sec max. (MIL-STD-202, Method 210)
Marking
On fuse:
None
Label on reel:
Shock
MIL-STD-202, Method 213, Test Condition I
(100 G’s peak for 6 milliseconds)
“bel”, “C2Q”, “Current Rating”, “32V; Interrupting Ratings” &
“rc”
Vibration
Packaging
MIL-STD-202, Method 201 (10-55 Hz, 0.06 inch,
total excursion)
5,000 fuses in 7 inches dia. reel, 8 mm wide tape, 4 mm pitch
per EIA-481 (equivalent IEC-286 part 3)
Salt Spray
Mechanical Dimensions
MIL-STD-202, Method 101,Test Condition B (48 hrs)
Insulation Resistance
MIL-STD-202, Method 302,Test Condition A
(After Opening) 10,000 ohms minimum
0
.0
.7
3
9
1
m
+
m
1.60mm
0
.1
-
+
0.004")
+
_
0.13mm
(
0
m
0
m
"
(0.063"
-
+
_
0.005")
0.48m
Solderability
MIL-STD-202, Method 208
+
Protective Overglaze
Element
Tin Plating
Nickel Barrier
Sliver Metalization
m
0.08m
0.003")
-
(0.019"
m
+
-
0
0
.3
.0
0
1
m
2
"
+
m
0
-
+
0.004")
.1
0
m
(
m
Resistance to Solder Heat
MIL-STD-202, Method 210,Test Condition F
(260°C, 20 sec)
C2Q
-
Ceramic Substrate
0.76mm
(0.03")
0.76mm
(0.03")
Thermal Shock
MIL-STD-202, Method 107,Test Condition B
(-65°C to +125°C)
1.02mm
(0.04")
1.27mm
(0.05")
0.76mm
(0.03")
0.66mm
(0.026")
OperatingTemperature
-55°C to +125°C
PAD LAYOUT RECOMMENDED
FOR INFRARED SOLDER
PAD LAYOUT RECOMMENDED
FOR WAVE SOLDER
S
ORDERING INFORMATION SEE PAGES 67 & 68
Bel Fuse Inc. 206 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: belfuse@belfuse.com
Website: www.belfuse.com
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