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0325.031VXP

更新时间: 2024-11-30 19:14:11
品牌 Logo 应用领域
力特 - LITTELFUSE 电路保护
页数 文件大小 规格书
1页 110K
描述
Electric Fuse, Time Lag Blow, 0.031A, 3AB,

0325.031VXP 技术参数

生命周期:ActiveReach Compliance Code:unknown
风险等级:5.22熔断特性:TIME LAG
主体高度:32.72 mm主体长度或直径:6.985 mm
电路保护类型:ELECTRIC FUSE保险丝尺寸:3AB
最高工作温度:125 °C最低工作温度:-55 °C
物理尺寸:6.985mm x 32.72mm预放电的额定值:0.011 A2/s
额定电流:0.031 A额定电压:250 V
参考标准:CE端子形状:PIN WIRE
断开时间或延迟:14400 sBase Number Matches:1

0325.031VXP 数据手册

  
TQM616035  
Advance Data Sheet  
WCDMA / HSUPA Band V&VI Power-PAD™-Module  
Functional Block Diagram  
Features  
Handset PowerPAD™ (PA-Duplexer)  
Module for UMTS Bands V&VI (Cellular  
band)  
Match  
RFIN  
Specified for HSDPA Modulation  
(HSUPA capable)  
Power  
Detector  
Integrates Power Amplifier, Highly  
Accurate Output Power Detector,  
Transmit Filter and Duplexer  
No Regulated Voltage Required  
Separate ‘Module Enable’ Pin  
All RF Ports Matched to 50 Ω  
Low Current Consumption:  
– 2 Power Modes  
ANT  
Bias Control  
– Continuous Bias in Low Power Mode  
– Extremely Low Idle Current  
(15mA typ.) in Low Power Mode  
Compatible for Low Collector Voltage  
Operation with DC-DC-Converters  
Product Description  
The PowerPAD™ is an integrated 3V Linear Power Amplifier, Duplexer and Transmit  
Filter Module including a highly accurate Output Power Detector designed for mobile  
UMTS handset applications, supporting HSUPA operation with transmission data-rates  
up to 10Mb/s.  
It features 2 output power modes, additional continuous bias in low power mode, low off  
and standby currents, and a separate pin for module enable. RF input and output  
matching is included within the module; therefore, minimal external circuitry is required.  
The PowerPAD™ gives excellent RF performance with low current consumption  
resulting in longer talk times in portable applications. The tiny 7x4x1.1 mm³ surface  
mount package is ideal for new generation slim, small and light phones.  
Applications  
3G UMTS Handsets and Data-Cards  
Package Style  
Electrical Specifications  
³
Compact 7 x 4 x 1.1 mm 16-Pin LGA  
Package  
Parameter  
Min  
826.4  
25  
Typ  
Max  
Units  
MHz  
dBm  
mA  
Frequency  
846.6  
Linear POUT(HSUPA) high power mode  
Maximum current high power mode  
Linear POUT(HSUPA) low power mode  
Idle current low power mode  
ACPR (HSUPA) 5 MHz  
410  
16  
dBm  
mA  
15  
-45  
-60  
2.5  
dBc  
dBc  
dB  
ALPR (HSUPA) 10 MHz  
Ant-to-RX Insertion Loss  
Test Conditions: VCC1 = VCC2= 3.4 V, T = 25°C  
1
Advance Data Sheet: Subject to change without notice  
For additional information and latest specifications, see our website: www.triquint.com  
Revision B, November 19, 2007  

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