19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
L
K
J
L
K
J
NOTES: VALID UNLESS OTHERWISE SPECIFIED
1. GENERAL:
a. APPLICATION SPECIFICATION: AS-31386-200
b. PRODUCT SPECIFICATION: PS-31387-200
c. PACKAGING SPECIFICATION: PK-31301-916
d. PARTS MUST BE IN COMPLIANCE TO MOLEX CHEMICAL SUBSTANCES FOR PRODUCTS AND
PACKAGING SPECIFICATION: ES-40000-5016
e. DATA MUST BE SUBMITTED UNDER THE MOLEX PART NUMBER TO IMDS (COMPANY ID#13255)
f. DIMENSIONS AND TOLERANCES ARE VALID FOR AS SHIPPED SHROUD ASSEMBLY
g. REFERENCE GM INTERFACE CONTROL DRAWINGS (ICD)
1. 12582682 (Au)
2. 12642695 (Ag)
2. DESIGN - MATERIALS:
a. PLASTIC PBT 30% GF - SEE CHART FOR COLOR
b. SIGNAL PIN PLATING:
H
G
F
H
G
F
- UNDERPLATE: NICKEL 1.27-2.54 µm
- SELECT GOLD OPTION: 0.76 µm MIN.
- SELECT SILVER OPTION: 1.90-3.30 µm MIN
- SOLDER TAIL SELECT TIN: 5.08-10.16 µm BRIGHT FINISH
c. GROUND PIN PLATING:
- UNDERPLATE: NICKEL 1.27-2.54 µm
- OVERPLATE: SELECT TIN 2.54-4.06 µm, MATTE FINISH
3. DESIGN - GEOMETRY:
a. THIS IS A 100% CAD GENERATED PART. THE CAD MATHEMATICAL DATA IS THE MASTER FOR ALL
NON-DIMENSIONAL FEATURES. DRAWING DIMENSIONS SHALL BE MET WHEN DIFFERENCES EXIST
BETWEEN THE DRAWING AND THE CAD MODEL. UNDERLINED DIMENSIONS OR DIMENSIONS INDICATED
AS "EDITED" MAY BE DIFFERENT FROM THE 3D MODEL GEOMETRY. FOR DIMENSIONAL OR ANY
INFORMATION NOT SHOWN ON THIS DRAWING, ANALYZE THE CAD MODEL.
b. PRODUCT DESIGN MODEL NUMBER(S): SEE BOM TABLE
UPDATED PCN 505530 FOR MNOR
DRAFT AND RADII
B15
B14
B13
NX REMASTERING
c. GEOMETRIC DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994
d. GENERAL TOLERANCES - SEE TABLE
CORRECTED REVISION COLUMN
CORRECTED PCB KEY DIM A
& DIM B FOR B & C KEYS
B12
B11
4. DESIGN - MANUFACTURING:
a. HUMAN READABLE LASER MARKING
UPDATED PCB KEY DIM A
& DIM B FOR ALL KEYS
UPDATE STATUS TO SALEABLE
1. INFORMATION TO BE PRINTED:
DDDY - 4 DIGIT JULIAN DATE CODE
E
D
C
B
A
E
D
C
B
A
S_HH - STITHCER NUMBER_HOUR NUMBER (24 HOUR CLOCK)
MMMM - LAST FOUR DIGITS OF MOLEX MATERIAL NUMBER
2. SIZE: HUMAN LEGIBLE
UPDATED NOTE 1c
(Au & Ag PACKAGING ARE
THE SAME) SAP# 10607192
B10
b. PIN MATE SIDE AND PCB SIDE TRUE POSITION TO BE VERIFIED ONLINE WITH A GO/NO-GO FUNCTIONAL
GAGE.
UPDATED NOTE 1c
SAP# 10595870
B9
B8
c. ANTI-TARNISH FOR Ag PLATING ONLY: SYTHETIC HYDROCARBON CONTACT SURFACE FINISH OR EQUIVALENT
APPLIED WITHOUT VOID TO CONTACT AREA (MIN. 3.7mm FROM PIN TIP).
d. VISUAL DEFECTS SHALL MEET COSMETIC STANDARD PS-45499-002 (CLASS B).
e. THERE SHALL BE NO PERMISSIBLE DEFECTS THAT COULD POTENTIALLY PROHIBIT THE FUNCTIONALITY
WITHIN THE SEALING SURFACE/ZONE SUCH AS PARTING LINES, MISMATCHES, SINK, TEXTURE
VARIATIONS, SCRATCHES/GOUGES, SHORT FILL, PROTRUSIONS, PITS, DENTS/NICKS, BLISTERS OR
EJECTOR MARKS
ADDED NOTE 4d, e & SEALING
ZONE DIMS ON PG 2
SAP# 10586362
MODIFIED HIGH RETENTION CAVITY
FOR 2.8 GROUND PIN
SAP# 10584227
B7
ADDED BALLOONS 1,2,6-15,19,20,
24-47; DELETED BALLOONS 3-5,17,
18,21-23
EDITED ALL NOTES, STATUS &
MATING HARNESS PART NUMBER
SAP# 10580347
INSPECTION BALLOON LOG
PER DRAWING REVISION: B8
LAST INSPECTION BALLOON: 47
ADDED BALLOON NUMBERS: 1 2 6 7 8 9 10 11 12 13 14 15 19 20 24 25 26 27 28 29
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
REMOVED BALLOON NUMBERS: 3 4 5 16 17 18 21 22 23
B6
REV
DESCRIPTION
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
MM
2:1
DRWN BY
DATE
ANGULAR TOL ± 3.0 °
FJAKLIC
04/30/08
04/30/08
05/05/08 SERIES
73 CKT SHROUD ASSEMBLY
0.64 SQ. PINS MX123
4 PLACES
3 PLACES
2 PLACES
1 PLACE
±
±
±
±
±
CHK'D BY
DATE
DATE
FJAKLIC
0.13
0.25
APPR BY
PRODUCT CUSTOMER DRAWING
GPRATT
MATERIAL NUMBER
CUSTOMER
0 PLACES
DRAWING SIZE
THIRD ANGLE PROJECTION
GENERAL MARKET
31387
SEE CHART
DRAFT WHERE APPLICABLE
MUST REMAIN
DOCUMENT NUMBER
DOC TYPE DOC PART SHEET NUMBER
D
WITHIN DIMENSIONS
B15
1 OF 3
SD-31387-073
PSD
000
RELEASE STATUS
RELEASE DATE
18
FORMAT: master-tb-prod-D
REVISION: G
19
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
DATE: 2017/02/06
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
