Surface Mount Fuses
FLAT-PAK® Slo-Blo® Fuse > 203 Series
AverageTime Current Curves
Temperature Re-rating Curve
100
10
1
.1
Note:
1. Rerating depicted in this curve is in addition to the standard derating of 25% for
continuous operation.
0.01
Soldering Parameters
Wave Soldering
Reflow Soldering
260°C, 3 seconds max.
215°C, 30 seconds max.
0.001
0.05 0.1
1
10
100
1000
CURRENT IN AMPERES
Dimensions
203G FLAT- PAK
203 FLAT- PAK
T 2A
250 V
PAT 4563666
Product Characteristics
T 2A
F
L
F
L
250 V
PAT 4563666
Body:Thermoplastic
Terminations:Tin/Lead Plated Copper
Materials
9.45
(.372")
9.45
(.372")
6.35
(.250")
6.35
(.250")
Solderability
Cleaning
MIL-STD-202, Method 208.
4.19
(.165")
4.19
(.165")
Board washable in most common solvents.
Operating Temperature –55OC to 125OC
0.08 (.003")
1.40 (.055")
1.52
(.060")
.135"
6o
10.16
(.400")
0.53
(.021")
15.24 (.600")
0.30(.012")
DIP Configuration
(Thru-Hole) Mounting
SMF Configuration
("Gull Wing" Surface Mount)
17.12(.674)
4.06(.160)
11.53(.454)
2.79 (.110)
Recommended Pad Layout
Part Numbering System
Packaging
Packaging
Option
Packaging
Specification
Quantity &
Packaging Code
Quantity
Surface Mount Fuses:
Through Hole Fuses:
0203 002. HXG
0203 002. H
Surface Mount Fuses
Bulk
–
100
500
HXG
URG
Series
Series
24mmTape
and Reel
EIA 481 (IEC60286,
part 3)
Amp Code
Amp Code
Through Hole Fuses
Refer to Amp Code column of
Refer to Amp Code column of
Antistatic
Magazine
Electrical Characteristics Table
Electrical Characteristics Table
–
100
H
Quantity Code
Quantity Code
H = 100
HXG = 100
URG = 500
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each
product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at:
www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/30/19