A Product Line of
Diodes Incorporated
ZXTR2008Z
Typical Application Circuit
Maximum Ratings (Voltage relative to GND, @TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VIN
Value
100
30
Unit
V
Input Voltage
Input Current
mA
mA
IIN
Continuous Output Current
30
IOUT
(Note 7)
(Note 8)
500
150
Pulsed Output Current
mA
IOM
Thermal Characteristics
Characteristic
Symbol
Value
1.7
Unit
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 9)
Power Dissipation
W
PD
0.89
59
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
R• JA
112
°C/W
20
R• JL
TJ
Recommended Operating Junction Temperature Range
-40 to +125
-65 to +150
°C
°C
Maximum Operating Junction and Storage Temperature Range
TJ , TSTG
ESD Ratings (Note 10)
Characteristics
Symbols
Value
• 4000
• 300
Unit
V
JEDEC Class
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Machine Model
ESD HBM
ESD MM
3A
B
V
Notes:
5. For a device mounted on 50mm X 50mm 1oz copper that is on a single-sided FR4 PCB; device measured under still air conditions whilst operating in
steady-state.
6. Same as note 5, except mounted on 15mm X 15mm 1oz copper.
7. Same as note 6, except measured with a single pulse width = 100µs and VIN=48V.
8. Same as note 6, except measured with a single pulse width = 10ms and VIN=48V.
9. Thermal resistance from junction to solder-point (on the exposed collector pad).
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
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May 2013
© Diodes Incorporated
ZXTR2008Z
Document number: DS36232 Rev. 1 - 2