Datasheet > Z0109NN/T3

Z0109NN/T3

更新时间： 2022-04-01 13:18:59

品牌	Logo	应用领域
恩智浦 - NXP		可控硅
页数	文件大小	规格书
15页	837K
描述
Logic level four-quadrant triac

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Z0109NN/T3 数据手册

Z0109NN

NXP Semiconductors

4Q Triac

5. Thermal characteristics

Table 5.

Symbol

R_th(j-sp)

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to solder

point

full cycle; see Figure 8

K/W

R_th(j-a)

thermal resistance

from junction to

ambient

full cycle; printed circuit board mounted;

minimum footprint; see Figure 6

156

K/W

full cycle; printed circuit board mounted;

pad area; see Figure 7

3.8 min

1.5

min

4.5

4.6

6.3

1.5

2.3

min

(3×)

1.5

min

4.6

001aab508

All dimensions are in mm

001aab509

All dimensions are in mm

Printed circuit board:

FR4 epoxy glass (1.6 mm thick), copper laminate

(35 um thick)

Fig 6. Minimum footprint SOT223

Fig 7. Printed circuit board pad area: SOT223

Z0109NN

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 05 — 18 March 2011

6 of 15

1...3 4 567 8 9...15

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