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Z0107MUF6AA4

更新时间： 2022-09-10 15:50:00

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		可控硅
页数	文件大小	规格书
12页	127K
描述
Standard 1A Triacs

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Z0107MUF6AA4 数据手册

Packaging information

Z01

Packaging information

●

Epoxy meets UL94, V0

Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Table 6.

SOT-223 dimensions

Dimensions

Millimeters

Min. Typ. Max. Min. Typ. Max.

Ref.

Inches

1.80

0.071

0.02 0.10

0.001 0.004

0.60 0.70 0.85 0.024 0.027 0.033

B1 2.90 3.00 3.15 0.114 0.118 0.124

0.24 0.26 0.35 0.009 0.010 0.014

D⁽¹⁾6.30 6.50 6.70 0.248 0.256 0.264

2.3

0.090

4.6

0.181

E⁽¹⁾3.30 3.50 3.70 0.130 0.138 0.146

6.70 7.00 7.30 0.264 0.276 0.287

10° max

1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)

Figure 15. SOT-223 footprint dimensions (in millimeters)

3.25

1.32

5.16

7.80

1.32

2.30

0.95

8/12

Doc ID 7474 Rev 10

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