Datasheet > YC164-FR-10560RL

YC164-FR-10560RL

更新时间： 2022-02-26 10:11:00

品牌	Logo	应用领域
国巨 - YAGEO		/
页数	文件大小	规格书
8页	338K
描述
ARRAY CHIP RESISTORS

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YC164-FR-10560RL 数据手册

Product specification

SERIES

164 (RoHS Compliant)

YC/TC

Chip Resistor Surface Mount

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

MIL-STD-202G-method 108A

IEC 60115-1 4.25.1

JIS C 5202-7.10

Life/

1,000 hours at 70±5 °C applied RCWV

1.5 hours on, 0.5 hour off, still air required

±(2%+0.05 Ω)

Operational Life/

Endurance

<100 mΩ for Jumper

MIL-STD-202G-method 108A

IEC 60115-1 4.25.3

High

Temperature

Exposure/

Endurance at

upper category

temperature

1,000 hours at maximum operating temperature

depending on specification, unpowered

±(1%+0.05 Ω)

<50 mΩ for Jumper

No direct impingement of forced air to the parts

Tolerances: 155±3 °C

JIS C 5202-7.11

MIL-STD-202G-method 106F

IEC 60115-1 4.24.2

Moisture

Resistance

Each temperature / humidity cycle is defined at 8

hours (method 106F), 3 cycles / 24 hours for 10d

with 25 °C / 65 °C 95% R.H, without steps 7a &

7b, unpowered

±(2%+0.05 Ω)

<100 mΩ for Jumper

Parts mounted on test-boards, without

condensation on parts

Measurement at 24±2 hours after

test conclusion

MIL-STD-202G-method 107G

Thermal Shock

-55/+155 °C

±(0.5%+0.05 Ω) for 10 KΩ to

10 MΩ

Note: Number of cycles required is 300. Devices

unmounted

±(1%+0.05 Ω) for others

<50 mΩ for Jumper

Maximum transfer time is 20 seconds. Dwell time

is 15 minutes. Air – Air

MIL-R-55342D-para 4.7.5

IEC60115-1 4.13

Short time

overload

2.5 times RCWV or maximum overload voltage

whichever is less for 5 sec at room temperature

±(2%+0.05 Ω)

<50 mΩ for Jumper

No visible damage

IEC60115-1 4.33

Board Flex/

Bending

Device mounted on PCB test board as described,

only 1 board bending required

±(1%+0.05 Ω)

<50 mΩ for Jumper

No visible damage

3 mm bending

Bending time: 60±5 seconds

Ohmic value checked during bending

www.yageo.com

Oct 27, 2008 V.3

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