Product specification
11
12
SERIES
102 to 358
YC/TC
Chip Resistor Surface Mount
TEST
TEST METHOD
J-STD-002 test
PROCEDURE
REQUIREMENTS
Solderability
- Wetting
Electrical Test not required
Magnification 50X
Well tinned (≥95% covered)
No visible damage
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
- Leaching
J-STD-002 test
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
MIL-STD-202-method 210
Condition B, no pre-heat of samples
±(1%+0.05 Ω)
Leadfree solder, 260 °C, 10 seconds
immersion time
<50 mΩ for Jumper
No visible damage
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
Biased Humidity
AEC-Q200 Test 7
1,000 hours; 85 °C / 85% RH
10% of operating power
± (5.0%+0.05 Ω)
MIL-STD-202-Method 103
Measurement at 24± 4 hours after test
conclusion.
www.yageo.com
Feb. 21, 2019 V.9