VSMP Series (ꢀ8ꢀꢁ, 12ꢀ6, 1ꢁꢀ6, 2ꢀ1ꢀ, 2ꢁ12) (Z-Foil)
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
FIGURE 3 - TYPICAL RESISTANCE/
(Conceptual Illustration)
TEMPERATURE CURVE
+ ꢁꢀꢀ
+ 4ꢀꢀ
+ 3ꢀꢀ
+ 2ꢀꢀ
+ 1ꢀꢀ
ꢀ
Current Path
Before Trimming
Interloop Capacitance
ΔR
Reduction in Series
R
(ppꢂ)
- 1ꢀꢀ
- 2ꢀꢀ
- 3ꢀꢀ
- 4ꢀꢀ
- ꢁꢀꢀ
ꢀ0ꢀꢁ ppꢂm/C
Current Path
After Trimming
Trimming Process
- ꢀ01 ppꢂm/C
ꢀ01 ppꢂm/C
ꢀ014 ppꢂm/C
Mutual Inductance
Reduction due
to Change in
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Current Direction
- ꢀ016 ppꢂm/C
- 2ꢁ
ꢀ02 ppꢂm/C
- ꢁꢁ
ꢀ
+ 2ꢁ
+ 6ꢀ + 7ꢁ + 1ꢀꢀ + 12ꢁ
Resistance
Aꢂbient Teꢂperature (/C) and TCR Chord Slopes for
Different Teꢂperature Ranges
Note
Note: Foil shown in black, etched spaces in white
• The TCR values for < 100 Ω are influenced by the termination
composition and result in deviation from this curve.
TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters)
Top View
Recoꢂꢂended Land Pattern
L
Footprint
X
G
W
T
Z
D
CHIP
SIZE
L
W
THICKNESS
D
Z (1)
G (1)
X (1)
ꢀ0ꢀꢀꢁ (ꢀ013)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
ꢀ0ꢀꢀꢁ (ꢀ013)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.23)
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
ꢀ0ꢀꢀꢁ (ꢀ013)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
0805
1206
1506
2010
2512
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
Note
(1)
Land Pattern Dimensions are per IPC-7351A
TABLE 3 - SPECIFICATIONS
TABLE 4 - LOAD LIFE STABILITY
(+ 70 °C for 2000 h)
RATED
POWER
(ꢂW)
MAX0
WORKING
VOLTAGE
RESISTANCE MAXIMUM
CHIP
SIZE
CHIP SIZE
MAXIMUM ΔR LIMITS
RANGE
WEIGHT
(ꢂg)
0.005 % at 100 mW
0.01 % at 200 mW
(Ω)
0805
at + 7ꢀ /C (≤ P × R )
0805
1206
1506
2010
2512
200
300
300
500
750
40 V
87 V
10 to 8K
10 to 25K
10 to 30K
10 to 70K
10 to 125K
6
0.005 % at 150 mW
0.01 % at 300 mW
0.005 % at 200 mW
0.01 % at 500 mW
0.005 % at 500 mW
0.01 % at 750 mW
1206, 1506
2010
11
12
27
40
95 V
187 V
220 V
2512
TABLE 5 - PERFORMANCES
MIL-PRF-ꢁꢁ342
CHARACTERISTIC E ΔR LIMITS
TYPICAL
ΔR LIMITS
MAXIMUM
TEST OR CONDITIONS
ΔR LIMITS (1)
Thermal Shock, 100 x (- 65 °C to + 150 °C)
Low Temperature Operation, - 65 °C, 45 min at Pnom
Short Time Overload, 6.25 x Rated Power, 5 s
High Temperature Exposure, + 150 °C, 100 h
Resistance to Soldering Heat
0.1 %
0.1 %
0.1 %
0.1 %
0.2 %
0.2 %
0.5 %
0.005 % (50 ppm)
0.005 % (50 ppm)
0.005 % (50 ppm)
0.01 % (100 ppm)
0.005 % (50 ppm)
0.005 % (50 ppm)
0.005 % (50 ppm)
0.01 % (100 ppm)
0.01 % (100 ppm)
0.01 % (100 ppm)
0.02 % (200 ppm)
0.01 % (100 ppm)
0.02 % (200 ppm)
0.01 % (100 ppm)
Moisture Resistance
Load Life Stability + 70 °C for 2000 h at Rated Power
Note
(1)
As shown + 0.01 Ω to allow for measurement errors at low values.
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Document Number: 63060
Revision: 24-Mar-09