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XREWHT-L1-0000-00601 PDF预览

XREWHT-L1-0000-00601

更新时间: 2024-02-08 22:54:06
品牌 Logo 应用领域
科锐 - CREE /
页数 文件大小 规格书
12页 764K
描述
XLamp㈢ XR-E LED

XREWHT-L1-0000-00601 数据手册

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®
®
Cree XLamp XR-E LED  
Data Sheet  
Cree XLamp LEDs combine the brightness of power LED chips with a rugged  
package capable of operating up to four watts. Cree XLamp LEDs lead the solid-  
state lighting industry in brightness while providing a reflow-solderable design  
that is optimized for ease of use and thermal management. Lighting applications  
featuring XLamp LEDs maximize light output and increase design flexibility, while  
minimizing environmental impact.  
Cree XLamp LEDs bring lighting-class brightness and efficiency to a wide range of  
lighting and backlighting applications, including portable lighting and flashlights,  
outdoor and industrial, signaling, architectural, landscaping and entertainment/  
advertising installations.  
FEATURES  
Guaranteed minimum flux order codes up to  
Industry-leading JEDEC standard pre-  
100 lm in white and 23.5 lm in blue  
qualification testing  
Over 80 lm/W available in white  
Reflow solderable – JEDEC J-STD-020C  
compatible  
Available in white (2,600 K to 10,000 K CCT),  
blue and royal blue  
Electrically neutral thermal path  
Drive currents: 350 to 1000 mA  
RoHS-compliant  
Industry’s lowest thermal resistance: 8°C/W  
Max junction temperature: 150°C  
Lumen maintenance of greater than 70% after  
50,000 hours  
Table of Contents  
Flux Characteristics (TJ = 25°C) ...............................................................................2  
Characteristics .........................................................................................................3  
Relative Spectral Power ...........................................................................................4  
Photometric Output vs. Junction Temperature (IF = 350 mA) ..................................5  
Electrical Characteristics (TJ = 25˚C) .......................................................................6  
Thermal Design ........................................................................................................6  
Relative Intensity vs. Current (TJ = 25˚C)................................................................7  
Typical Spatial Radiation Pattern..............................................................................7  
Reflow Soldering Characteristics..............................................................................8  
Notes........................................................................................................................9  
Mechanical Dimensions (TA = 25°C) .......................................................................ꢀ0  
Tape and Reel.........................................................................................................ꢀꢀ  
Dry Packaging and Packaging ................................................................................ꢀ2  
Subject to change without notice.  
www.cree.com/xlamp  

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