5秒后页面跳转
XR1001 PDF预览

XR1001

更新时间: 2024-02-29 17:13:11
品牌 Logo 应用领域
MIMIX 射频和微波射频上变频器射频下变频器微波上变频器微波下变频器
页数 文件大小 规格书
8页 1417K
描述
33.0-40.0 GHz GaAs MMIC Receiver

XR1001 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.24特性阻抗:50 Ω
构造:COMPONENT下变频增益-最小值:1 dB
最大中频频率:3000 MHz最小中频频率:
LO 可调谐:YES最大射频输入频率:40000 MHz
最小射频输入频率:34000 MHz射频/微波设备类型:DOWN CONVERTER
Base Number Matches:1

XR1001 数据手册

 浏览型号XR1001的Datasheet PDF文件第2页浏览型号XR1001的Datasheet PDF文件第3页浏览型号XR1001的Datasheet PDF文件第4页浏览型号XR1001的Datasheet PDF文件第5页浏览型号XR1001的Datasheet PDF文件第6页浏览型号XR1001的Datasheet PDF文件第7页 
33.0-40.0 GHz GaAs MMIC  
Receiver  
May 2005 - Rev 13-May-05  
R1001  
Handling and Assembly Information  
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the  
human body and the environment. For safety, observe the following procedures:  
Do not ingest.  
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical  
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.  
Observe government laws and company regulations when discarding this product.This product must be  
discarded in accordance with methods specified by applicable hazardous waste procedures.  
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support  
devices or systems without the express written approval of the President and General Counsel of Mimix  
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for  
surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in  
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a  
significant injury to the user. (2) A critical component is any component of a life support device or system whose  
failure to perform can be reasonably expected to cause the failure of the life support device or system, or to  
affect its safety or effectiveness.  
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied  
in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-  
static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care,  
sharp tweezers.  
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the  
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as  
possible.The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are  
Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy  
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total  
2
die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001  
thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated  
collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere  
is recommended.The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold  
+
Germanium should be avoided).The work station temperature should be 310 C 10 C. Exposure to these  
-
extreme temperatures should be kept to minimum.The collet should be heated, and the die pre-heated to avoid  
excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.  
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to  
the die's gold bond pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x  
0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm  
(0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be  
avoided.Thermo-compression bonding is recommended though thermosonic bonding may be used providing  
the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters.  
Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short  
as possible.  
Page 8 of 8  
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099  
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com  
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.  
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept  
their obligation to be compliant with U.S. Export Laws.  

与XR1001相关器件

型号 品牌 描述 获取价格 数据表
XR1001-BD MIMIX 33.0-40.0 GHz GaAs MMIC Receiver

获取价格

XR1001-BD-000V MIMIX 33.0-40.0 GHz GaAs MMIC Receiver

获取价格

XR1001-BD-000W MIMIX 33.0-40.0 GHz GaAs MMIC Receiver

获取价格

XR1001-BD-EV1 MIMIX 33.0-40.0 GHz GaAs MMIC Receiver

获取价格

XR-1001CN ETC Analog Filter

获取价格

XR-1001CP ETC Analog Filter

获取价格