Datasheet > XPC862PCZP50B

XPC862PCZP50B

更新时间： 2024-01-14 12:35:54

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
88页	966K
描述
IC,COMMUNICATIONS CONTROLLER,BGA,357PIN

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技术参数
数据手册

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XPC862PCZP50B 技术参数

生命周期：	Transferred	包装说明：	BGA, BGA357,19X19,50
Reach Compliance Code：	unknown	风险等级：	5.65
JESD-30 代码：	S-PBGA-B357	端子数量：	357
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA357,19X19,50
封装形状：	SQUARE	封装形式：	GRID ARRAY
电源：	3.3 V	认证状态：	Not Qualified
子类别：	Other uPs/uCs/Peripheral ICs	标称供电电压：	3.3 V
表面贴装：	YES	技术：	CMOS
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	Base Number Matches：	1

XPC862PCZP50B 数据手册

Freescale Semiconductor, Inc.

Power Dissipation

Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,

and 2:1 mode, where CPU frequency is twice bus speed.

Table 4. Power Dissipation (P )

Die Revision

Frequency

Typical

Maximum

Unit

50 MHz

66 MHz

50 MHz

66 MHz

80 MHz

100 MHz

656

TBD

630

890

910

1.06

1.35

735

TBD

760

(1:1 Mode)

A.1, B.0

(1:1 Mode)

1000

1060

1.20

1.54

A.1, B.0

(2:1 Mode)

B.0

(2:1 Mode)

Typical power dissipation is measured at 3.3 V.

Maximum power dissipation is measured at 3.5 V.

NOTE

Values in Table 4 represent VDDL based power dissipation and do not

include I/O power dissipation over VDDH. I/O power dissipation varies

widely by application due to buffer current, depending on external

circuitry.

MPC862/857T/857DSLHardwareSpeciﬁcations

MOTOROLA

For More Information On This Product,

Go to: www.freescale.com

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