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XPC8260ZUIFBC PDF预览

XPC8260ZUIFBC

更新时间: 2024-01-02 13:10:19
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 外围集成电路时钟
页数 文件大小 规格书
50页 847K
描述
PowerQUICC II Integrated Communications Processor Hardware Specifications

XPC8260ZUIFBC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Transferred零件包装代码:BGA
包装说明:LBGA, BGA480,29X29,50针数:480
Reach Compliance Code:not_compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.31
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:66.66 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B480
JESD-609代码:e0长度:37.5 mm
低功率模式:NO湿度敏感等级:3
端子数量:480最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA480,29X29,50
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度):220电源:2.5,3.3 V
认证状态:Not Qualified座面最大高度:1.65 mm
速度:200 MHz子类别:Microprocessors
最大供电电压:1.9 V最小供电电压:1.7 V
标称供电电压:1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:37.5 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

XPC8260ZUIFBC 数据手册

 浏览型号XPC8260ZUIFBC的Datasheet PDF文件第2页浏览型号XPC8260ZUIFBC的Datasheet PDF文件第3页浏览型号XPC8260ZUIFBC的Datasheet PDF文件第4页浏览型号XPC8260ZUIFBC的Datasheet PDF文件第5页浏览型号XPC8260ZUIFBC的Datasheet PDF文件第6页浏览型号XPC8260ZUIFBC的Datasheet PDF文件第7页 
Document Number: MPC8260AEC  
Rev. 2.0, 06/2009  
Freescale Semiconductor  
Technical Data  
MPC8260A  
PowerQUICC™ II Integrated  
Communications Processor  
Hardware Specifications  
Contents  
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Electrical and Thermal Characteristics . . . . . . . . . . . . 7  
3. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23  
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 46  
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 48  
7. Document Revision History . . . . . . . . . . . . . . . . . . . 48  
This document contains detailed information on power  
considerations, DC/AC electrical characteristics, and AC  
timing specifications for .25μm (HiP4) devices in the  
PowerQUICC II™ MPC8260 communications processor  
family. These devices include the MPC8260, the MPC8255,  
the MPC8264, the MPC8265, and the MPC8266.  
Throughout this document, these devices are collectively  
referred to as the MPC826xA.  
© Freescale Semiconductor, Inc., 2005–2009. All rights reserved.  

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