Datasheet > XOPA3S2859MRTWREP

XOPA3S2859MRTWREP

更新时间： 2023-09-03 20:28:30

品牌	Logo	应用领域
德州仪器 - TI		放大器
页数	文件大小	规格书
28页	1949K
描述
增强型产品双通道 900MHz、2.2nV/√Hz 可编程增益跨阻放大器 \| RTW \| 24 \| -55 to 125

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OPA3S2859-EP

ZHCSMS7B –APRIL 2021 –REVISED DECEMBER 2021

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

(V_S–) –0.5

MAX

UNIT

V_S

Total supply voltage (V_S+- V_S-)

Input voltage

5.5

V_IN+, V_IN-

V_ID

(V_S+) + 0.5

Differential input voltage

Output voltage

(V_S+) + 0.5

±4

V_OUT

I_IN

I_OUT

T_J

Continuous input current

Continuous output current⁽²⁾

Junction temperature

Operating free-air temperature

Storage temperature

°C

150

T_A

125

–55

–65

T_stg

150

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2) Long-term continuous output current for electromigration limits

6.2 ESD Ratings

VALUE

±1500

±1000

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾

Electrostatic

discharge

V_(ESD)

Charged device model (CDM), per JEDEC specification JEDEC JS-002, all pins⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

3.3

NOM

MAX

5.25

125

UNIT

V_S

T_A

Total supply voltage (V_S+- V_S-)

Ambient temperature

°C

–55

6.4 Thermal Information

OPA3S2859-EP

RTW

THERMAL METRIC⁽¹⁾

UNIT

24 PINS

54.1

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

55.6

30.6

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

2.5

Ψ_JT

30.6

Ψ_JB

R_θJC(bot)

13.9

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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