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XBP24CZ7PITB003

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XBP24CZ7PITB003 数据手册

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

XBee/XBee-PRO S2C 802.15.4 RF Modules are embedded solutions providing wireless end-point

connectivity to devices. These devices use the IEEE 802.15.4 networking protocol for fast point-to-

multipoint or peer-to-peer networking. They are designed for high-throughput applications requiring

low latency and predictable communication timing.

There are two footprints for the XBee/XBee-PRO S2C 802.15.4 RF Module hardware: through-hole (TH)

and surface-mount (SMT). TH devices include a 20-pin header and require the placement of two 1x10

sockets on the carrier board for mounting the device. SMT devices include 37 pads. They are placed

directly on the carrier board, which means they do not require holes or sockets for mounting.

The TH version may be useful for prototyping and production, but we recommend SMT for high-

volume applications, as the component can be placed automatically by a pick-and-place machine and

you save the cost of a socket on each board.

The XBee/XBee-PRO S2C 802.15.4 RF Module supports the needs of low-cost, low-power wireless

sensor networks. The devices require minimal power and provide reliable delivery of data between

devices. The devices operate within the ISM 2.4 GHz frequency band.

The XBee/XBee-PRO S2C 802.15.4 RF Module uses S2C hardware and the Silicon Labs EM357 chipset.

As the name suggests, the 802.15.4 module is over-the-air compatible with our Legacy 802.15.4

module (S1 hardware), and the TH versions of the new product are also form factor compatible with

designs that use the Legacy module.

Note OTA capability is only available when MM (Mac Mode) = 0 or 3

Applicable firmware and hardware

Safety instructions

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

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