生命周期: | Obsolete | 包装说明: | FRIT SEALED, CERAMIC, LCC-32 |
Reach Compliance Code: | unknown | 风险等级: | 5.32 |
最长访问时间: | 120 ns | JESD-30 代码: | R-GQCC-N32 |
长度: | 13.97 mm | 内存密度: | 1048576 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 32 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 128KX8 |
输出特性: | 3-STATE | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | QCCN | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER | 并行/串行: | PARALLEL |
编程电压: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 3.048 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | NO LEAD |
端子节距: | 1.27 mm | 端子位置: | QUAD |
宽度: | 11.43 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
X28C010GM-15 | RENESAS |
获取价格 |
EEPROM, 128KX8, 150ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GM-15T1 | RENESAS |
获取价格 |
EEPROM, 128KX8, 150ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GM-20 | RENESAS |
获取价格 |
EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GM-20T1 | RENESAS |
获取价格 |
EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GM-25 | RENESAS |
获取价格 |
EEPROM, 128KX8, 250ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GMB-12 | RENESAS |
获取价格 |
EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GMB-12T1 | RENESAS |
获取价格 |
EEPROM, 128KX8, 120ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GMB-15 | RENESAS |
获取价格 |
EEPROM, 128KX8, 150ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GMB-15T1 | RENESAS |
获取价格 |
EEPROM, 128KX8, 150ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | |
X28C010GMB-20 | RENESAS |
获取价格 |
EEPROM, 128KX8, 200ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 |