Datasheet > X24C02B

X24C02B

更新时间： 2024-01-04 10:19:37

品牌	Logo	应用领域
ICMIC		可编程只读存储器
页数	文件大小	规格书
16页	294K
描述
Serial E2PROM

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技术参数
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X24C02B 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	DIP	包装说明：	DIP,
针数：	8	Reach Compliance Code：	unknown
ECCN代码：	3A001.A.2.C	HTS代码：	8542.32.00.51
风险等级：	5.76	最大时钟频率 (fCLK)：	0.1 MHz
JESD-30 代码：	R-PDIP-T8	长度：	10.03 mm
内存密度：	2048 bit	内存集成电路类型：	EEPROM
内存宽度：	8	湿度敏感等级：	3
功能数量：	1	端子数量：	8
字数：	256 words	字数代码：	256
工作模式：	SYNCHRONOUS	最高工作温度：	125 °C
最低工作温度：	-55 °C	组织：	256X8
封装主体材料：	PLASTIC/EPOXY	封装代码：	DIP
封装形状：	RECTANGULAR	封装形式：	IN-LINE
并行/串行：	SERIAL	峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified	座面最大高度：	4.07 mm
串行总线类型：	I2C	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V	标称供电电压 (Vsup)：	5 V
表面贴装：	NO	技术：	CMOS
温度等级：	MILITARY	端子形式：	THROUGH-HOLE
端子节距：	2.54 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	7.62 mm
最长写入周期时间 (tWC)：	10 ms	Base Number Matches：	1

X24C02B 数据手册

X24C02

ORDERING INFORMATION

V_CCLimits

X24C02

-V

Blank = 4.5V to 5.5V

3.5 = 3.5V to 5.5V

3 = 3.0V to 5.5V

2.7 = 2.7V to 5.5V

Device

G = RoHS Compliant Lead Free packge

Blank = Standard package. Non lead free

Temperature Range

Blank = Commercial = 0°C to +70°C

I = Industrial = –40°C to +85°C

M = Military = –55°C to +125°C

Package

P = 8-Lead Plastic DIP

S8 = 8-Lead SOIC

M = 8-Lead MSOP

Part Mark Convention

X24C02 X G

Blank = 8-Lead SOIC

P = 8-Lead Plastic DIP

S8 = 8-Lead SOIC

M = 8-Lead MSOP

G= RoHS compliant lead free

Blank = 4.5V to 5.5V, 0°C to +70°C

I = 4.5V to 5.5V, –40°C to +85°C

M = 4.5V to 5.5V, –55°C to 125°C

B = 3.5V to 5.5V, 0°C to +70°C

C = 3.5V to 5.5V, –40°C to +85°C

D = 3.0V to 5.5V, 0°C to +70°C

E = 3.0V to 5.5V, –40°C to +85°C

F = 2.7V to 5.5V, 0°C to +70°C

G = 2.7V to 5.5V, –40°C to +85°C

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express,

statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no

warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without

notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402;

4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents

pending.

LIFE RELATED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection

and correction, redundancy and back-up features to prevent such an occurence.

Xicor's products are not authorized for use in critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose

failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the

user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support

device or system, or to affect its safety or effectiveness.

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与X24C02B相关器件

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X24C02BG	ICMIC	Serial E2PROM	获取价格
X24C02BM	ICMIC	Serial E2PROM	获取价格
X24C02BP	ICMIC	Serial E2PROM	获取价格
X24C02BS8	ICMIC	Serial E2PROM	获取价格
X24C02C	ICMIC	Serial E2PROM	获取价格
X24C02CG	ICMIC	Serial E2PROM	获取价格

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