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X1288S16I PDF预览

X1288S16I

更新时间: 2024-01-11 01:15:24
品牌 Logo 应用领域
XICOR 计时器或实时时钟微控制器和处理器外围集成电路光电二极管监控可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
31页 559K
描述
2-Wire RTC Real Time Clock/Calendar/CPU Supervisor with EEPROM

X1288S16I 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:0.300 INCH, PLASTIC, SOIC-16Reach Compliance Code:unknown
风险等级:5.71Is Samacsys:N
最大时钟频率:0.032 MHz信息访问方法:I2C
中断能力:YJESD-30 代码:R-PDSO-G16
JESD-609代码:e0长度:10.35 mm
端子数量:16计时器数量:1
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP16,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE电源:5 V
认证状态:Not Qualified座面最大高度:2.65 mm
子类别:Timer or RTC最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL最短时间:1/100 SECOND
易失性:YES宽度:7.5 mm
uPs/uCs/外围集成电路类型:TIMER, REAL TIME CLOCKBase Number Matches:1

X1288S16I 数据手册

 浏览型号X1288S16I的Datasheet PDF文件第23页浏览型号X1288S16I的Datasheet PDF文件第24页浏览型号X1288S16I的Datasheet PDF文件第25页浏览型号X1288S16I的Datasheet PDF文件第27页浏览型号X1288S16I的Datasheet PDF文件第28页浏览型号X1288S16I的Datasheet PDF文件第29页 
Preliminary Information  
X1288  
A final application for the ATR control is in-circuit cali-  
bration for high accuracy applications, along with a  
temperature sensor chip. Once the RTC circuit is pow-  
ered up with battery backup, the PHZ output is set at  
32.768kHz and frequency drift is measured. The ATR  
control is then adjusted to a setting which minimizes  
drift. Once adjusted at a particular temperature, it is  
possible to adjust at other discrete temperatures for  
minimal overall drift, and store the resulting settings in  
the EEPROM. Extremely low overall temperature drift  
is possible with this method. The Xicor evaluation  
board contains the circuitry necessary to implement  
this control.  
ity of the RTC device. A small decoupling capacitor at  
the Vcc pin of the chip is mandatory, with a solid con-  
nection to ground.  
The X1286 product has a special consideration. The  
PHZ/IRQ- pin on the 8-lead SOIC package is located  
next to the X2 pin. When this pin is used as a fre-  
quency output (PHZ) and is set to 32.768kHz output  
frequency, noise can couple to the X1 or X2 pins and  
cause double-clocking. The layout in figure 19 can help  
minimize this by running the PHZ output away from the  
X1 and X2 pins. Also, minimizing the switching current  
at this pin by careful selection of the pullup resistor  
value will reduce noise. Xicor suggests a minimum  
value of 5.1k for 32.768kHz, and higher values (i.e.  
20k) for lower frequency PHZ outputs.  
For more detailed operation see Xicor’s application  
note AN154 on Xicor’s website at www.xicor.com.  
For other RTC products, the same rules stated above  
should be observed, but adjusted slightly since the  
packages and pinouts are slightly different.  
Layout Considerations  
The crystal input at X1 has a very high impedance and  
will pick up high frequency signals from other circuits  
on the board. Since the X2 pin is tied to the other side  
of the crystal, it is also a sensitive node. These signals  
can couple into the oscillator circuit and produce dou-  
ble clocking or mis-clocking, seriously affecting the  
accuracy of the RTC. Care needs to be taken in layout  
of the RTC circuit to avoid noise pickup. Below in Fig-  
ure 19 is a suggested layout for the X1286 or X1288  
devices.  
Assembly  
Most electronic circuits do not have to deal with  
assembly issues, but with the RTC devices assembly  
includes insertion or soldering of a live battery into an  
unpowered circuit. If a socket is soldered to the board,  
and a battery is inserted in final assembly, then there  
are no issues with operation of the RTC. If the battery  
is soldered to the board directly, then the RTC device  
Vback pin will see some transient upset from either sol-  
dering tools or intermittent battery connections which  
can stop the circuit from oscillating. Once the battery is  
soldered to the board, the only way to assure the circuit  
will start up is to momentarily (very short period of  
time!) short the Vback pin to ground and the circuit will  
begin to oscillate.  
Figure 19. Suggested Layout for Xicor RTC in SO-8  
C1  
3.1µF  
Oscillator Measurements  
When a proper crystal is selected and the layout guide-  
lines above are observed, the oscillator should start up  
in most circuits in less than one second. Some circuits  
may take slightly longer, but startup should definitely  
occur in less than 5 seconds. When testing RTC cir-  
cuits, the most common impulse is to apply a scope  
probe to the circuit at the X2 pin (oscillator output) and  
observe the waveform. DO NOT DO THIS! Although in  
some cases you may see a useable waveform, due to  
the parasitics (usually 10pF to ground) applied with the  
R1 13k  
U1  
XTAL1  
X1286/X1288  
±2.768kGz  
The X1 and X2 connections to the crystal are to be  
kept as short as possible. A thick ground trace around  
the crystal is advised to minimize noise intrusion, but  
ground near the X1 and X2 pins should be avoided as  
it will add to the load capacitance at those pins. Keep in  
mind these guidelines for other PCB layers in the vicin-  
26 of 31  
REV 1.1.30 3/24/04  
www.xicor.com  

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