Datasheet > WW25BR008JTL

WW25BR008JTL

更新时间： 2024-04-09 18:57:50

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	268K
描述
2512(6432), 0.008Ω, ±5%, 3W

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WW25BR008JTL 数据手册

Approval sheet

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

TEST

PROCEDURE

Natural resistance change per change in degree centigrade.

R₂ R

REQUIREMENT

Temperature

Coefficient of

Resistance(T.C.R)

Refer to

“QUICK REFERENCE DATA”

10⁶(ppm/C) t₁: 20°C+5°C-1°C

₁t₂t₁

Clause 4.8

R₁: Resistance at reference temperature

R₂: Resistance at test temperature +155°C

Permanent resistance change after a 5second application of 5 no visible damage

times rated power

Short time overload

(S.T.O.L)

IEC60115-1

J: R/R max. ±(2%+0.5m)

F: R/R max. ±(1%+0.5m)

Clause 4.13

Un-mounted chips completely immersed for 10±1second in a

SAC solder bath at 260℃±5ºC

no visible damage

Resistance to soldering

heat (R.S.H)

J: R/R max. ±(1%+0.5m)

F: R/R max. ±(0.5%+0.5m)

good tinning (>95% covered)

no visible damage

Clause 4.18

Un-mounted chips completely immersed for 3±0.5second in a

SAC solder bath at 235℃±5℃

Solderability

Clause 4.17

no visible damage

Temperature cycling

30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30

minutes at +155C3C, 2~3 minutes at 20°C+5°C-1°C, total 5

continuous cycles

Clause 4.19

J: R/R max. ±(1%+0.5m)

F: R/R max. ±(0.5%+0.5m)

1000 +48/-0 hours, loaded with RCWV or Vmax in chamber no visible damage

Load life (endurance)

controller 70±2ºC, 1.5 hours on and 0.5 hours off

Clause 4.25

J: R/R max. ±(3%+0.5m)

F: R/R max. ±(1%+0.5m)

1000 +48/-0 hours, loaded with RCWV or Vmax in humidity no visible damage

Load life in Humidity

chamber controller at 40C2C and 90~95% relative humidity,

1.5hours on and 0.5 hours off

Clause 4.24

J: R/R max. ±(3%+0.5m)

F: R/R max. ±(1%+0.5m)

Pressurizing force: 1Kg, Test time: 60±1sec.

Adhesion

No remarkable damage or

removal of the terminations

Clause 4.32

Bending strength

no visible damage

Bending 2mm on 90mm FR4 PCB

J: R/R max. ±(1%+0.5m)

F: R/R max. ±(0.5%+0.5m)

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JUN - 2020

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