Approval
sheet
TEST AND REQUIREMENTS
REQUIREMENT
TEST
PROCEDURE / TEST METHOD
Resistor
Within the specified tolerance
Refer to “QUICK REFERENCE
DATA”
Electrical Characteristics
- DC resistance values measurement
- Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree
centigrade.
JISC5201-1: 1998
Clause 4.8
R2 R
106 (ppm/C)
t1 : 20°C+5°C-1°C
1
R
1t2 t1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Un-mounted chips completely immersed for 10±1second
in a SAC solder bath at 270℃±5ºC
Resistance to soldering
heat(R.S.H)
ΔR/R max. (1.0%+0.005)
no visible damage
MIL-STD-202
method 210
a) Bake the sample for 155℃ dwell time 4hrs/ solder
dipping 235℃/ 5sec.
Solderability
J-STD-002
95% coverage min., good
b) Steam the sample dwell time 8 hour/ solder dipping 215
tinning and no visible damage
℃/ 5sec.
c) Steam the sample dwell time 8 hour/ solder dipping 260
℃/ 7sec.
1000 cycles, -55℃ ~ +155℃, dwell time 30min
R/R max. (1.0%+0.005)
Temperature cycling
JESD22
maximum.
No visible damage
Method JA-104
R/R max. (1.0%+0.005)
No visible damage
Moisture Resistance
MIL-STD-202
652C, 80~100% RH, 10 cycles, 24 hours/ cycle
method 106
1000+48/-0 hours; 85C, 85% RH, 10% of operation
R/R max. (2.0%+0.005)
Bias Humidity
MIL-STD-202
method 103
power
No visible damage
Operational Life
1000+48/-0 hours; 35% of operation power, 1252C
R/R max. (2.0%+0.005)
MIL-STD-202
108
method
No visible damage
High Temperature Exposure 1000+48/-0 hours; without load in a temperature
R/R max. (2%+0.005)
MIL-STD-202
Method 108
chamber controlled 1553C
No visible damage
Board Flex
Resistors mounted on a 90mm glass epoxy resin
PCB(FR4),bending once 2mm for 60sec.
R/R max. (1.0%+0.005)
No visible damage
AEC-Q200-005
Terminal strength
AEC-Q200-006
Pressurizing force: 1.8Kg, Test time: 60±1sec.
No remarkable damage or
removal of the terminations
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