Datasheet > WW08SR008FTLJ

WW08SR008FTLJ

更新时间： 2024-04-09 18:57:48

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
9页	1083K
描述
0805(2012), 0.008Ω, ±1%, 1/2W

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WW08SR008FTLJ 数据手册

Approval sheet

Test Method

(AEC-Q200. IEC 60115)

Test Item

Specification

External Visual

AEC-Q200 TABLE 7.9

Inspect device construction, marking and

workmanship.

No visual damage and refer

the marking code

specification.

Within the specification..

Physical

AEC-Q200 TABLE 7.10

Verify physical dimensions to the applicable device

detail specification.

Dimension

Within product

specification tolerance

and no visible damage.

Mechanical Shock

Vibration

AEC-Q200 TABLE 7.13

Test Peak value:100g's,Wave:Hail-sine,

Duration:6ms,Velocity:12.3ft/sec.

0 mΩ : ≦0.2 mΩ

AEC-Q200 TABLE 7.14

5 g's for 20 min., 12 cycles each of 3 orientations.

Test from 10-2000 Hz.

Others: △R≦ ±1%

and no visual damage

0 mΩ : ≦0.2 mΩ

*Resistance

AEC-Q200 TABLE 7.15

Solder dipping @ 270℃±5℃ for 10sec.±1sec.

To Solder Heat

Others : ΔR≦ ±1%

No mechanical damage.

0 mΩ : ≦0.2 mΩ

Others :ΔR≦ ±1%

No mechanical damage.

Thermal Shock

ESD

AEC-Q200 TABLE 7.16

-55 to 155℃/ dwell time 15min/ Max transfer time

20sec/ 300cycles.

0 mΩ : ≦0.2 mΩ

AEC-Q200-002

Test contact min. 1KV.

Others: ΔR≦ ±1%

No mechanical damage.

Over 95% of termination

must be covered with

solder.

*Solder Ability

AEC-Q200 TABLE 7.18

a)Baking 155℃ 4H, dipping 235℃ 5s

b)Steam 8H, dipping 215℃ 5s

c)Steam 8H, dipping 260℃ 7s

IEC 60115-1, Clause 4.17 for General Type

After immersing flux, dip in the

245℃±2℃ molten solder bath for 3± 0.5sec

Refer UL-94.

Flammability

*Board Flex

AEC-Q200 TABLE 7.20

UL-94 V-0 or V-1 are acceptable

0 mΩ : ≦0.2 mΩ

AEC-Q200 TABLE 7.21

Bending 2mm for 60 seconds.

Others:ΔR≦ ±2%

No mechanical damage.

No cracking or no part

being sheared off from

its pad

Terminal strength

AEC-Q200-006

Pressurizing force: 1Kg, Test time: 60±1sec

Page 7 of 9

ASC_WW08S_J-WW08U_J_AUTO_V03

Mar - 2024

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