生命周期: | Transferred | 包装说明: | HERMETIC SEALED, CERAMIC, HIP-66 |
Reach Compliance Code: | unknown | 风险等级: | 5.55 |
最长访问时间: | 25 ns | 其他特性: | USER CONFIGURABLE AS 512K X 8 |
备用内存宽度: | 16 | JESD-30 代码: | S-CHIP-P66 |
内存密度: | 4194304 bit | 内存集成电路类型: | SRAM MODULE |
内存宽度: | 32 | 功能数量: | 1 |
端子数量: | 66 | 字数: | 131072 words |
字数代码: | 128000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 128KX32 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装形状: | SQUARE | 封装形式: | IN-LINE |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
筛选级别: | MIL-STD-883 | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | PIN/PEG |
端子位置: | HEX | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WS128K32N-25HCE | WEDC |
获取价格 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP | |
WS128K32N-25HI | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-25HIE | WEDC |
获取价格 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP | |
WS128K32N-25HM | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-25HQ | ETC |
获取价格 |
x32 SRAM Module | |
WS128K32N-25HQE | WEDC |
获取价格 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP | |
WS128K32N-25HSIE | WEDC |
获取价格 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP | |
WS128K32N-25HSQE | WEDC |
获取价格 |
SRAM Module, 512KX8, 25ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP | |
WS128K32N-35G1TC | WEDC |
获取价格 |
SRAM, | |
WS128K32N-35G1TCA | WEDC |
获取价格 |
SRAM, |