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WR01W3742PDL PDF预览

WR01W3742PDL

更新时间: 2022-05-14 22:13:23
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
8页 439K
描述
Thick Film General Purpose chip resistors

WR01W3742PDL 数据手册

 浏览型号WR01W3742PDL的Datasheet PDF文件第1页浏览型号WR01W3742PDL的Datasheet PDF文件第3页浏览型号WR01W3742PDL的Datasheet PDF文件第4页浏览型号WR01W3742PDL的Datasheet PDF文件第5页浏览型号WR01W3742PDL的Datasheet PDF文件第6页浏览型号WR01W3742PDL的Datasheet PDF文件第7页 
Approval sheet  
FEATURE  
1. Ultra small and high precision size and light weight  
2. High reliability and stability  
3. Reduced size of final equipment  
4. Suitable for high density print circuit board assembly  
5. Higher component and equipment reliability  
6. Lead free product  
APPLICATION  
Mobile phone  
PDA, MP3, Ipod, iPHONE  
DSC, DVs  
Palmtop computers  
Mini module  
DESCRIPTION  
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are  
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The  
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to  
nominated value within tolerance which controlled by laser trimming of this resistive layer.  
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For  
ease of soldering the outer layer of these end terminations is a pure Tin.  
Fig 1. Construction of Chip-R WR01X  
Page 2 of 8  
ASC_WR01X_V06  
JAN - 2017  

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