Datasheet > WQBD1608K2U221TP

WQBD1608K2U221TP

更新时间： 2024-04-09 18:57:50

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
11页	2279K
描述
SMD Ferrite Chip Bead (AEC-Q200)/ WQBD Series 1000, 200mA

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WQBD1608K2U221TP 数据手册

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Approval Sheet

Test item

ESD

Test condition

Classification Levels 1C

Criteria

1. No mechanical damage

2. Impedance value should be

within ± 30 % of the initial value

1. More than 95 % of terminal

electrode should be covered with

new solder

1000 V (DC) to < 2000 V (DC)

1. Solder temperature : 235 ± 5℃

2. Flux : Rosin

Solderability Test

Board Flex

3. DIP time : 5 ± 1 sec

2. No mechanical damage

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

No mechanical damage.

60s minimum holding time

Size

Apply Force(F) Test Time

Terminal Strength

1005

1608

≧2012

10 ±1 sec

60 ±1 sec

No mechanical damage

10 N

17.7 N

LAND PATTERNS FOR REFLOW SOLDERING

SOLDER LAND INFORMATION

Unit: mm (inches)

Size

1005

1608

2012

3216

1.2 ～ 1.4

(0.047 ～ 0.055)

1.8 ～ 2.0

(0.071 ～ 0.079)

3.0 ～ 4.0

(0.118 ～ 0.157)

4.2 ～ 5.2

(0.165 ～ 0.205)

0.4

(0.016)

0.7

(0.028)

1.2

(0.047)

2.0

(0.079)

0.5

(0.020)

0.7

(0.028)

1.0

(0.039)

1.2

(0.047)

Page 11 of 11

ASC_ WQBD1005- 3216 Series

Nov - 2019

1...8 9 1011

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