Approval Sheet
Reliability and Test Conditions
Test item
Test condition
Criteria
1.More than 95 % of terminal
electrode should be covered with
new solder
Solder temperature : 260 ± 5℃
Flux : Rosin
2.No mechanical damage
Resistance to Solder Heat
3.Inductance value should be within
± 20 % of the initial value
DIP time : 10 ± 1 sec
* Apply DC 0.4 ~ 0.6A to chip for 1 ~
3 sec. before to measure
inductance.
1. More than 95 % of terminal
Solder temperature : 235 ± 5℃
Flux : Rosin
electrode should be covered with
new solder
Solderability
3. DIP time : 5 ± 1 sec
2. No mechanical damage
Reflow temperature : 245℃ It shall be
Soldered on the substrate applying direction
parallel to the substrate
1. No mechanical damage
Adhesive Test
2. Soldering the products on PCB
after the pulling test force > 5 N
Apply force(F) : 5 N
Test time : 10 sec
1.No mechanical damage
Temperature:-40 ~ 85℃ For 30 minutes
2.Inductance should be within ±20%
of the initial value
each
Temperature Cycle
Cycle: 100 cycles
* Apply DC 0.4 ~ 0.6A to chip for 1 ~
3 sec. before to measure
inductance.
Measurement:At ambient temperature 24
hours after test completion
1. No mechanical damage
Temperature: 85 ± 5℃
2. Inductance should be within ±20%
of the initial value
High Temperature
Resistance
Testing time: 1000 hrs
* Apply DC 0.4 ~ 0.6A to chip for 1 ~
3 sec. before to measure
inductance.
Measurement: at ambient temperature 24
hours after test completion
1.No mechanical damage
Temperature: 40℃ ± 2℃
Humidity: 90-95 % RH
Testing time: 1000 hrs
2.Inductance should be within ±20%
of the initial value
Humidity
* Apply DC 0.4 ~ 0.6A to chip for 1 ~
3 sec. before to measure
inductance.
Measurement:At ambient temperature 24
hours after test completion
At ambient temperature & humidity
WLFM product surface temp
Rated Current
Testing time:5 minutes ( under full rated
current )
below room temperature plus 40℃
Page 5 of 7
ASC_WLFM_C Series
Jul.2020