Datasheet > WLCW1005Z0G13NTB

WLCW1005Z0G13NTB

更新时间： 2024-03-18 20:21:55

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	282K
描述
SMD Wire Wound Ceramic Chip RF Inductor / WLCW Series 13, 24, 440mA

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WLCW1005Z0G13NTB 数据手册

RELIABILITY PERFORMANCE

Reliability Experiment For Electrical

Test Item

Test Condition

Standard Source

MIL-STD-202G

Method 103B

Test Condition B

+40℃± 2℃, humidity of 90% ± 5% (total 96 hours).

Humidity Test

1.Temperature: +125℃±2℃

2.Test time: 48±2hrs

High Temperature

Test

IEC 68-2

Test Condition B

1.Temperature: -40℃±2℃

2.Test time: 48±2hrs

Low Temperature

Test

IEC 68-2

Test Condition A

MIL-STD-202G

Method 107G

Test Condition B-

+125℃±5℃ (30 minutes) ~ -40 ± 5℃ (30 minutes),

temperature switch time: 5 minutes (total 50 cycles).

Thermal Shock

Life Test

MIL-STD-202G

Method 108A

Test Condition B

+70℃±5℃ (250Hours)

Reliability Experiment For Physical

Test Item

Test Condition

Standard Source

10-55-10HZ, amplitude: 1.5mm, direction: X, Y, Z axes, MIL-STD-202G

Vibration Test

each axis 2 hours (total 6 hours).

Method 201A

IR/convection reflow:Peak Temp 250±5℃ for 5Sec in

air, Through 2 Cycle. Temperature

Ramp:+1~4°C/sec; Above1 83°C, must keep 90 s - 120

MIL-STD-202G

Method 210F

Test Condition

(Reflow)

Solder Heat

Resistance Test

Soak in 245 ℃ solder pot of 3Sec, PAD must have

95% above coverage.

Solder Ability Test

J-STD-003B

Page 5 of 7

ASC_WLCW1005 Series_V8.0

Nov. Y2017

1 2 3 456 7

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