Datasheet > WIP252012P-R68ML

WIP252012P-R68ML

更新时间： 2024-03-18 20:21:49

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	604K
描述
SMD Molded Power Choke / WIP Series 0.68, 3.7A

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WIP252012P-R68ML 数据手册

Reliability Testing

Test item

Test condition

Criteria

1. More than 95 % of terminal

electrode should be covered with

new solder

1. Solder temperature : 260 ± 5℃

2. Flux : Rosin

Resistance to Solder Heat

2. No mechanical damage

3. DIP time : 10 ± 1 sec

3. Inductance value should be

within ± 20 % of the initial value

1. Reflow temperature : 245℃ It shall be

Soldered on the substrate applying

direction parallel to the substrate

2. Apply force(F) : 5 N

1. No mechanical damage

2. Soldering the products on PCB

after the pulling test force > 5 N

Adhesive Test

3. Test time : 10 sec

1. Temperature:-50 ~ 125℃ For 30

minutes each

1. No mechanical damage

2. Cycle: 500 cycles

2. Inductance should be within

Temperature Cycle

3. Measurement: At ambient temperature ±20% of the initial value

24 hours after test completion

1. Temperature: 85 ± 2℃

2. Testing time: 500 hours

1. No mechanical damage

Dry Heat Test

3. Applied current: Full rated current

2. Inductance should be within ±

4. Measurement: At ambient temperature 20% of the initial value

24 hours after test completion

1. Temperature: 60 ± 2℃

2. Humidity: 90-95 % RH

1. No mechanical damage

2. Inductance should be within

±20% of the initial value

3. Applied current: Full rated current

4. Testing time: 500 hours

Humidity Test

5. Measurement: At ambient temperature

24 hours after test completion

Page 5 of 8

ASC_WLPH252012_P Series

2019.03

1 2 3 456 7 8

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