Datasheet > WIP252012P-3R3ML

WIP252012P-3R3ML

更新时间： 2024-03-18 20:21:49

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	604K
描述
SMD Molded Power Choke / WIP Series 3.3, 2A

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数据手册

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WIP252012P-3R3ML 数据手册

Reference IPC-020c-5-1

Profile Feature

Pb free Assembly

Average Ramp Rate

(Ts max to Tp)

Preheat

3 ℃/second max

Temperature Min (Ts_min

Temperature Min (Ts_max

Time(ts_minto ts_min

)

150℃

)

200℃

)

60-180 seconds

Time maintained above:

Temperature (TL)

Time (tL)

217℃

60-150 seconds

260℃ +0/-5 ℃

Peak Temperature (T_p)

Time within 5 ℃ of actual Peak

Temperature (T_p)

20-40 seconds

Ramp-Down Rate

6 ℃/second max.

Time 25℃ to Peak Temperature

8 minutes max

Soldering gun procedure

Note the follows, in case of using solder gun for replacement.

(1)The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under

30 W.

(2)The soldering gun tip shall not touch this product directly.

Soldering volume

Note that excess of soldering volume will easily get crack the body of this product.

Taping Package Storage Condition

Storage Temperature : 5 to 40 ℃

Relative Humidity: < 65%RH

Storage Time : 12 months max.

Page 8 of 8

ASC_WLPH252012_P Series

2019.03

1...5 6 78

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