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WIP252010P-1R0ML PDF预览

WIP252010P-1R0ML

更新时间: 2024-03-18 20:21:49
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
8页 652K
描述
SMD Molded Power Choke / WIP Series 1, 3A

WIP252010P-1R0ML 数据手册

 浏览型号WIP252010P-1R0ML的Datasheet PDF文件第2页浏览型号WIP252010P-1R0ML的Datasheet PDF文件第3页浏览型号WIP252010P-1R0ML的Datasheet PDF文件第4页浏览型号WIP252010P-1R0ML的Datasheet PDF文件第5页浏览型号WIP252010P-1R0ML的Datasheet PDF文件第6页浏览型号WIP252010P-1R0ML的Datasheet PDF文件第8页 
Taping specifications  
There shall be the portion having no product in both the head and the end of taping, and there shall be  
the cover tape in the head of taping.  
Label Marking  
The label specified as follows shall be put on the side of reel.  
(1) Part No  
(2) Quantity  
(3) Lot No  
* Part No. And Quantity shall be marked on outer packaging.  
Quantity of products in the taping package  
(1)Standard quantity3000pcs/Reel  
(2)Shipping quantity is a multiple of standard quantity.  
Precautions for Handling  
Precaution for handling of substrate  
Do not exceed to bend the board after soldering this product extremely. (reference examples)  
Mounting place must be as far as possible from the position, which is close to the break line of  
board, or on the line of large holes of board.  
Do not bend extremely the board, in mounting another components.  
If necessary, use back-up pin (support pin) to prevent from bending extremely.  
Do not break the board by hand. We recommend to use the machine or the jig to break it.  
Precaution for soldering  
Note that this product will be easily damaged by rapid heating, rapid cooling or local heating.  
Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and  
gradual cooling.  
Recommendable reflow soldering  
Page 7 of 8  
ASC_WLPH252010_P Series  
2019.03  

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