Approval sheet
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp heat,
long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST
PROCEDURE / TEST METHOD
Resistor
Within the specified tolerance
Refer to “QUICK REFERENCE
DATA”
Electrical Characteristics
-
-
DC resistance values measurement
Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree
centigrade.
JISC5201-1: 1998
Clause 4.8
R2 − R
×106 (ppm/°C)
t1 : 20°C+5°C-1°C
1
R
(
t2 − t1
)
1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Un-mounted chips completely immersed for 10±1second
in a SAC solder bath at 270℃±5ºC
Resistance to soldering
heat(R.S.H)
∆R/R max. ±(1.0%+0.05Ω)
no visible damage
MIL-STD-202
method 210
a) Bake the sample for 155℃ dwell time 4hrs/ solder
dipping 235℃/ 5sec.
Solderability
J-STD-002
95% coverage min., good
tinning and no visible damage
b) Steam the sample dwell time 8 hour/ solder dipping 215
℃/ 5sec.
c) Steam the sample dwell time 8 hour/ solder dipping 260
℃/ 7sec.
1000 cycles, -55℃
~
+155℃, dwell time 30min ∆R/R max. ±(1.0%+0.05Ω)
Temperature cycling
JESD22
maximum.
No visible damage
Method JA-104
∆R/R max. ±(1.0%+0.05Ω)
No visible damage
Moisture Resistance
MIL-STD-202
65±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle
method 106
1000+48/-0 hours; 85°C, 85% RH, 10% of operation ∆R/R max. ±(2.0%+0.10Ω)
Bias Humidity
MIL-STD-202
method 103
power
No visible damage
Operational Life
1000+48/-0 hours; 35% of operation power, 125±2°C
∆R/R max. ±(2.0%+0.1Ω)
MIL-STD-202
108
method
No visible damage
High Temperature Exposure 1000+48/-0 hours; without load in
a
temperature ∆R/R max. ±(2.0%+0.10Ω)
MIL-STD-202
Method 108
Board Flex
chamber controlled 155±3°C
No visible damage
Resistors mounted on a 90mm glass epoxy resin ∆R/R max. ±(1.0%+0.05Ω)
AEC-Q200-005
PCB(FR4),bending once 2mm for 60sec.
No visible damage
Page 7 of 8
ASC_WFxxP_J_V03
DEC 2016