Approval Sheet
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
TEST
PROCEDURE
Resistor
DC resistance
DC resistance values measured
Within the specified tolerance
Clause 4.5
Temperature
Coefficient of
Resistance(T.C.R)
Natural resistance change per change in degree Refer to
centigrade.
“ QUICK REFERENCE DATA “
R2 − R
×106 (ppm/°C)
1
Clause 4.8
R
(
t2 − t1
)
1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 20°C+5°C-1°C
t2 : 125°C+5°C-1°C
Short time overload
(S.T.O.L)
Permanent resistance change after
a
5second
∆R/R max. ±(0.1%+0.05Ω)
application of a voltage 2.5 times RCWV or the
maximum overload voltage specified in the above list,
whichever is less.
Clause 4.13
Resistance to
soldering
heat(R.S.H)
IEC 60068-2-
58:2004
Un-mounted
10±1second in a SAC solder bath at 260℃±5ºC
chips
completely
immersed
for no visible damage
∆ R/R max. ±(0.1%+0.05Ω)
Solderability
Un-mounted chips completely immersed for 2±0.5 good tinning (>95% covered)
second in a SAC solder bath at 235℃±5℃
IEC 60068-2-
58:2004
no visible damage
Temperature
cycling
no visible damage
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-
1°C, 30 minutes at +155 °C±3°C, 2~3 minutes at
20°C+5°C-1°C, total 5 continuous cycles
∆R/R max. ±(0.25%+0.05Ω)
Clause 4.19
Load Life
70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5
∆R/R max. ±(0.25%+0.05Ω)
hours on and 0.5 hours off
(Endurance)
Clause 4.25
Humidity
1000 hours, at rated continuous working voltage in
humidity chamber controller at 40°C±2°C and 90~95%
relative humidity, 1.5hours on and 0.5 hours off
∆R/R max. ±(0.25%+0.05Ω)
∆R/R max. ±(0.1%+0.05Ω)
Clause 4.24
Bending strength
Clause 4.33
Adhesion
Resistors mounted on a 90mm glass epoxy resin
PCB(FR4); bending : 3 mm, once for 10 seconds.
Pressurizing force: 5N, Test time: 10±1sec.
No remarkable damage or removal of the
terminations.
Clause 4.32
Page 8 of 10
ASC_WFxxC
MAR 2018