Datasheet > WED8L24514V-B

WED8L24514V-B

更新时间： 2024-01-06 11:05:29

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
5页	612K
描述
DSP56300 Family

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中文翻译

获取价格

数据手册

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WED8L24514V-B 数据手册

WED8L24514V

Asynchronous SRAM, 3.3V, 512Kx24

512Kx24 bit CMOS Static

The WED8L24514VxxBC is a 3.3V, twelve megabit SRAM

constructed with three 512Kx8 die mounted on a multi-

layer laminate substrate. With 10 to 15ns access times, x24

width and a 3.3V operating voltage, the WED8L24514V is

ideal for creating a single chip memory solution for the

Motorola DSP5630x or a two chip solution for the Analog

Devices SHARC^TMDSP.

Random Access Memory Array

• Fast Access Times: 10, 12, and 15ns

• Master Output Enable and Write Control

• Three Chip Enables for Byte Control

• TTL Compatible Inputs and Outputs

• Fully Static, No Clocks

The single or dual chip memory solutions offer improved

system performance by reducing the length of board

traces and the number of board connections compared

to using multiple monolithic devices.

Surface Mount Package

• 119 Lead BGA (JEDEC MO-163), No. 391

• Small Footprint, 14mmx22mm

• Multiple Ground Pins for Maximum Noise Immunity

Single +3.3V ( 5ꢀ) Supply Operation

DSP Memory Solution

The JEDEC Standard 119 lead BGA provides a 61ꢀ

space savings over using three 512Kx8, 400 mil wide

SOJs and the BGA package has a maximum height of 110

mils compared to 148 mils for the SOJ packages.

• Motorola DSP5630x

• Analog Devices SHARC^TM

A_0-18

Address Inputs

Chip Enable

A_O

A₅

A₁

A₆

E₂

A₂

E₀

A₃

A₇

E₃

A₄

A₈

Master Write Enable

Master Output Enable

Common Data Input/Output

Power (3.3V 5ꢀ)

Ground

I/0₁₂

I/0₁₃

I/0₁₄

I/0₁₅

I/0₁₆

I/0₁₇

I/0₁₈

I/0₁₉

I/0₂₀

I/0₂₁

I/0₂₂

I/0₂₃

I/0₀

I/0₁

I/0₂

I/0₃

I/0₄

I/0₅

I/0₆

I/0₇

I/0₈

I/0₉

I/0₁₀

I/0₁₁

DQ_0-23

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

A₁₈

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

A₁₇

No Connection

-A18

A₉

A₁₃

A₁₀

A₁₄

A₁₁

A₁₅

A₁₂

A₁₆

512K x 24

Memory

Array

DQ0-7

DQ8-15

DQ16-23

September 2001 Rev. 2

ECO #14670

White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com

12 3 4 5

中文翻译

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与WED8L24514V-B相关器件

型号	品牌	获取价格	描述	数据表
WED8L24514V-BC	ETC	获取价格	SRAM MCP
WED8LM32129C-15ECT	WEDC	获取价格	SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-15EITA	WEDC	获取价格	SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-15EMTA	WEDC	获取价格	SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17ECT	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17ECTA	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17EIT	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EIT	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EITA	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EMT	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

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