Datasheet > WED8LM32129C-15EITA

WED8LM32129C-15EITA

更新时间： 2024-11-09 20:10:07

品牌	Logo	应用领域
WEDC		静态存储器内存集成电路
页数	文件大小	规格书
6页	154K
描述
SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

WED8LM32129C-15EITA 数据手册

浏览型号WED8LM32129C-15EITA的Datasheet PDF文件第2页

浏览型号WED8LM32129C-15EITA的Datasheet PDF文件第3页

浏览型号WED8LM32129C-15EITA的Datasheet PDF文件第4页

WED8LM32129C

HI-RELIABILITY PRODUCT

128Kx32 SRAM MODULE PRELIMINARY*

FEATURES

■ Access Times of 15, 17, 20, 25, 35, 45, 55ns

■ Low Power CMOS

■ Packaging

■ TTL Compatible Inputs and Outputs

■ Built in Decoupling Caps and Multiple Ground Pins for Low

• 68 lead, 23.88mm Low Profile CQFP, 3.56mm (0.140")

Noise Operation

■ Organized as 128Kx32; User Configurable as 256Kx16 or

■ Device is upgradeable to 512Kx32

512Kx8

■ Commercial, Industrial and Military Temperature Ranges

■ 5 Volt Power Supply

* This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

FIG. 1 PIN CONFIGURATION FOR WED8LM32129C-E

TOP VIEW

PIN DESCRIPTION

I/O0-31

A0-16

WE1-4

CS1-4

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

68 67 66 65 64 63 62 61

I/O

I/O16

I/O17

I/O18

I/O19

I/O20

I/O21

I/O22

I/O23

GND

I/O24

I/O25

I/O26

I/O27

I/O28

I/O29

I/O30

I/O31

Output Enable

Power Supply

Ground

VCC

0.940"

GND

The WEDC 68 lead CQFP fills

the same fit and function as the

JEDEC 68 lead CQFJ or 68

PLCC. But the CQFP has the

TCE and lead inspection

GND

Not Connected

I/O

I/O10

I/O11

I/O12

I/O13

I/O14

I/O15

advantage of the CQFP form.

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

BLOCK DIAGRAM

WE₁CS₁

WE₂CS₂

WE₃CS₃

WE₄CS₄

0-16

128K x 8

I/O16-23

I/O24-31

I/O0-7

I/O8-15

July 1999 Rev. 0

White Electronic Designs Corporation • (602) 437-1520 • www.whitedc.com

12 3 4 5 6

中文翻译

下载PDF

与WED8LM32129C-15EITA相关器件

型号	品牌	获取价格	描述	数据表
WED8LM32129C-15EMTA	WEDC	获取价格	SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17ECT	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17ECTA	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-17EIT	WEDC	获取价格	SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EIT	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EITA	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EMT	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-20EMTA	WEDC	获取价格	SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-25ECT	WEDC	获取价格	SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
WED8LM32129C-25ECTA	WEDC	获取价格	SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

与WED8LM32129C-15EITA相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

22
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

21
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

47
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

39

产品中心

服务支持

精选活动

关于我们

帮助中心

WED8LM32129C-15EITA

WED8LM32129C-15EITA 数据手册

与WED8LM32129C-15EITA相关器件

与WED8LM32129C-15EITA相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

WED8LM32129C-15EITA

WED8LM32129C-15EITA 数据手册

与WED8LM32129C-15EITA相关器件

与WED8LM32129C-15EITA相关文章

您还可以找

您在本页遇到什么问题？