W7NxxxVHxxBISx
White Electronic Designs
ADVANCED*
Secure Embedded SLC NAND SSD PBGA
FEATURES
Built in ATA/PCMCIA 2.1, and compact flash 3.0
Storage Capacities:
4GBYTE and 8GBYTE**
Environment conditions:
interface capability
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Hardware & software triggered security erase that
meets:***
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Operating temperature: -40°C to 85°C
Storage temperature: -55°C to 125°C
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NISPOM DoD 5220.22-M
NSA - 130-2
SLC Flash
Airforce AFSSI - 5020
Army AR380-19
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3.3V single power supply
256 Bytes of attribute memory
Navy NAVSO P-5234-26
Power consumption
Page read operation
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3.3V ± 10%
Page Program time: 200μs (Typ)
Block erase time: 1.5ms (Typ)
Program/Erase lockout during transition
Active mode: Read, Write, Erase operation:
95 mA (Typ), 150 (Max)
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Sleep mode: 10 mA (Typ); TBD mA (Max)
Secure erase: 85 mA (Max) (4GB)
Data transfer rate: Up to 66MB/s UDMA mode 4
Up to 25MB/s PIO mode 6 or
MDMA mode 4
Interface modes
Sustained read: Up to 45 MBytes/s
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PC card memory mode
Sustained write: Up to 30 MBytes/s with interleaving
Random read: Up to 35 MBytes/s
PC card I/O mode
True IDE mode
Random write: Up to 6 MBytes/s
Less than 1 Error in 1014 bits read
MTBF > 4,000,000 hours
DESCRIPTION
High shock & vibration tolerance
W/E Endurance: 4,000,000 write/erase cycles
High performance
The W7NxxxVHxxBISx series embedded SLC NAND
SSD PBGA is based on flash technology. This product is
constructed with 32bit RISC base controller and SLC NAND
flash memory devices. They operate from a single 3.3 volt
power supply. Capacity ranges from 4GB to 8GB**.
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Interface Transfer speed in PIO mode 6
Typical write: 30 MBytes/s in ATA PIO mode 6
Typical read: 45 MBytes/s in ATA PIO mode 6
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
** 8GB capacity is TBD.
On card ECC up to 4 Bytes per 512 Byte data
sector
Dimensions:
*** This feature will not be available for sample production
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27mm x 22mm x 2.60mm
Highly resistant to data corruption due to power loss
Single device connector free solution for embedded
environments
TABLE 1
Item
Size
4GB
Performance
Sophisticated wear leveling firmware
W7N2G16VHxxBISx
W7N4G16VHxxBISx
Enhanced reliability with a 1.27mm pitch; eutectic
tin-lead solder ball
3.0 to 3.60
8GB**
Same form, fit and functionality as W7NxxxVHxxBI
with the following exceptions: M9 = EXTPWR and
L11 = EXTTRIG for secure erase
November 2009
Rev. 1
© 2010 White Electronic Designs Corp. All rights reserved
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White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com