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VSP3200Y PDF预览

VSP3200Y

更新时间: 2024-02-17 02:54:05
品牌 Logo 应用领域
德州仪器 - TI 商用集成电路传感器
页数 文件大小 规格书
7页 776K
描述
适用于 CCD/CMOS/CIS 传感器的 16 位、8MSPS 3 通道 AFE,双输出模式 | PT | 48 | 0 to 85

VSP3200Y 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP48,.35SQ,20针数:48
Reach Compliance Code:compliantHTS代码:8542.39.00.01
Factory Lead Time:6 weeks风险等级:1.14
商用集成电路类型:CONSUMER CIRCUITJESD-30 代码:S-PQFP-G48
JESD-609代码:e4长度:7 mm
湿度敏感等级:1功能数量:1
端子数量:48最高工作温度:85 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP48,.35SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:1.6 mm
子类别:Other Consumer ICs最大供电电压 (Vsup):5.3 V
最小供电电压 (Vsup):4.7 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7 mm
Base Number Matches:1

VSP3200Y 数据手册

 浏览型号VSP3200Y的Datasheet PDF文件第1页浏览型号VSP3200Y的Datasheet PDF文件第3页浏览型号VSP3200Y的Datasheet PDF文件第4页浏览型号VSP3200Y的Datasheet PDF文件第5页浏览型号VSP3200Y的Datasheet PDF文件第6页浏览型号VSP3200Y的Datasheet PDF文件第7页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Nov-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
VSP3200Y  
VSP3200YG4  
VSP3210Y/2K  
ACTIVE  
ACTIVE  
NRND  
LQFP  
LQFP  
LQFP  
PT  
PT  
PT  
48  
48  
48  
250  
250  
RoHS & Green  
RoHS & Green  
NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 85  
VSP3200Y  
Samples  
Samples  
NIPDAU  
NIPDAU  
VSP3200Y  
VSP3210Y  
2000 RoHS & Green  
0 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  

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