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VSC8223XRV PDF预览

VSC8223XRV

更新时间: 2024-02-22 23:25:34
品牌 Logo 应用领域
美高森美 - MICROSEMI ATM异步传输模式电信电信集成电路
页数 文件大小 规格书
26页 489K
描述
ATM/SONET/SDH Clock Recovery Circuit, CMOS, PQFP48,

VSC8223XRV 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:QFP, QFP48,.35SQ,20Reach Compliance Code:unknown
风险等级:5.82JESD-30 代码:S-PQFP-G48
端子数量:48最高工作温度:85 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP48,.35SQ,20
封装形状:SQUARE封装形式:FLATPACK
电源:2.5 V认证状态:Not Qualified
子类别:ATM/SONET/SDH ICs最大压摆率:217 mA
标称供电电压:2.5 V表面贴装:YES
技术:CMOS电信集成电路类型:ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
温度等级:OTHER端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
Base Number Matches:1

VSC8223XRV 数据手册

 浏览型号VSC8223XRV的Datasheet PDF文件第1页浏览型号VSC8223XRV的Datasheet PDF文件第2页浏览型号VSC8223XRV的Datasheet PDF文件第4页浏览型号VSC8223XRV的Datasheet PDF文件第5页浏览型号VSC8223XRV的Datasheet PDF文件第6页浏览型号VSC8223XRV的Datasheet PDF文件第7页 
VSC8223  
Datasheet  
REVISION HISTORY  
This section describes the changes that were implemented in this document. The changes are listed by revision,  
starting with the most current publication.  
Revision 4.0  
Revision 4.0 of this datasheet was published in July 2007. The following is a summary of the changes implemented in  
the datasheet:  
The device is now available in a lead(Pb)-free package.  
ESD and moisture sensitivity specifications were added. For more information,  
see “Stress Ratings,” page 19 and “Moisture Sensitivity,” page 25.  
The thermal specifications were updated. For more information, see “Thermal Specifications,” page 25.  
The system-level block diagram was updated to reference new products. The LVPECL input terminations diagram  
was also updated. For more information, see “System-Level Block Diagram,” page 2 and LVPECL Input  
Terminations,” page 7.  
For the supported upper and lower data ranges, the lower data range for HIGH (1) was changed from 150 Mbps to  
155 Mbps and the lower data range for LOW (0) was changed from 600 Mbps to 622 Mbps.  
The recommended REFCLK input frequencies for STS-12/-3 FEC were updated. For more information,  
see Table 6, page 10.  
The conditions for the jitter tolerance and jitter transfer bandwidth parameters were updated to include  
LBW [1:0] = 0, 0.  
The maximum values for the CRU lock time (synchronous and asynchronous switch) parameters were changed to  
typical values.  
The operating temperature parameter was clarified as ambient to case and the minimum value was changed from  
–40 °C to –20 °C.  
The minimum values for the power supply current parameters were updated and the power supply requirements  
table (formerly table 17) was integrated with the recommended operating conditions. For more information, see  
“Recommended Operating Conditions,” page 19.  
In the electrical specifications section, the voltage input swing (single-ended drive), input high voltage, REFCLK  
input duty cycle, input HIGH current, input LOW current, and case temperature parameters were removed.  
Errata information was also removed.  
Revision 2.0  
Revision 2.0 of this datasheet was published in October 2002. This was the first publication of the document.  
3 of 26  
G52417 Revision 4.0  
July 2007  

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